Topic
Electronic packaging
About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.
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01 Jan 2009
TL;DR: In this article, the authors reviewed the challenges of LED packaging materials and pointed out the direction of further development, which presents serious challenges to the development of LEDs packaging materials, which is exactly the objective of this chapter.
Abstract: As for integrated circuit (IC) device packaging, the packaging materials are critical to the LED packaging because the device packaging and assembly yield, and the device reliability and lifetime are determined by the quality of packaging and assembly materials as well as their processing. This presents serious challenges to the development of LED packaging materials, which is exactly the objective of this chapter to review those challenges and to point out the direction of further development.
15 citations
Patent•
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IBM1
TL;DR: Disclosed as mentioned in this paper is a multilayer electronics packaging structure designed for use in a multi-chip module, which increases the via punch pitch such that multiple wiring channels are formed between adjacent vias, and reduces the number of signal distribution layers.
Abstract: Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch pitch such that multiple wiring channels are formed between adjacent vias, wirability is improved and the number of signal distribution layers may be reduced. The new structure thus shows improved electrical properties over the state-of-the-art structures, combined with a cost reduction of about 35%.
15 citations
01 Jan 2005
TL;DR: In this article, a commercial off-the-shelf (COTS) MEMS humidity sensor, the Hygrometrix HMX2000, was selected as a representative MEMS sensor for packaging development.
Abstract: Liquid crystal polymer (LCP) is a thermoplastic material with a variety of useful properties that can be exploited to yield new types of packaging for MEMS sensors. Although each type of MEMS sensor has unique packaging requirements, a commercial-off-the-shelf (COTS) MEMS humidity sensor, the Hygrometrix HMX2000 was selected as a representative MEMS sensor for packaging development. The packaging process consists of patterning and Sn coating the Cu cladding on the LCP substrate, followed by micromachining the LCP substrate to realize an environmental access port for the sensor. The sensor is then attached to the LCP substrate using AuSn intermetallic bonding on a flip chip bonder.
15 citations
TL;DR: In this paper, a cyclic loading in the form of four-point bending is applied and the mechanical fatigue life is measured for five groups of wafer level chip scale packaging (WLCSP) structures with different displacement amplitudes at a constant temperature of 125°C.
15 citations
01 Sep 2020
TL;DR: In this article, a low reflow temperature solder with melting point around 80°C was studied and the wetting angle was about 52° after reflow at 100°C for 10min.
Abstract: SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.
15 citations