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Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.


Papers
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Journal ArticleDOI
TL;DR: In this paper, the principles of laser resistor trimming, laser types used, trimming techniques, and technology trends are described. But laser cutting of ceramics in such applications as electronic packaging and the use of lasers to pattern thin films are also discussed.
Abstract: Laser resistor trimming, an effective tool for producing accurate and reliable electrical elements is discussed. Laser trimming has minimum effect on power handling capability; element value variation with time, temperature, and voltage; and electrical noise. The principles of laser trimming, laser types used, trimming techniques, and technology trends are described. Laser cutting of ceramics in such applications as electronic packaging and the use of lasers to pattern thin films are also discussed. >

13 citations

Proceedings ArticleDOI
27 Mar 2009
TL;DR: In this paper, the first check valve featuring dual regulation of in-plane flow and heat-shrink tubing packaging is presented, which is optimized for integration into low profile fluidic devices requiring flow control, such as drug delivery devices.
Abstract: The first check valve featuring dual regulation of in-plane flow and heat-shrink tubing packaging is presented. This modular design is optimized for integration into low-profile fluidic devices requiring flow control, such as drug delivery devices. Theoretical and finite-element-modeling (FEM) analyses were performed to guide valve design and these results were confirmed experimentally. The valve regulates flow between 150-900 mmHg (20-120 kPa) and withstands ≫ 500 mmHg (66.7 kPa) of reverse pressure. The heat-shrink packaging scheme does not require adhesives and is extremely robust (≫2000 mmHg without leakage).

13 citations

Proceedings ArticleDOI
18 May 1988
TL;DR: In this article, the authors proposed a hybrid approach using polymer layer overlays laminated over bare chips mounted on a substrate. And they showed that the overlay layer makes the entire chip area available for interconnect lines and can be removed and replaced without chip damage.
Abstract: High-density interconnect (HDI) is a unique, novel, hybrid approach currently in the development stages at the GE Research and Development Center. Our approach uses polymer layer overlays laminated over bare chips mounted on a substrate. The over-lays are laser-patterned with copper to connect the chips and I/O. The advantages of the HDI hybrid approach can be summarized as follows: •The overlay layer makes the entire chip area available for interconnect lines. •The interconnect has very high density: 2-mil pitch has been demonstrated. •Via and line formation are under computer control. Thus, no patterning mask is used. Chip misalignment is accommodated by computer-adaptive writing. •Copper is the conductor metallization. •The chips can be almost touching. •The interconnect technology accommodates any chip size and mixed chip technologies. •The process is ideal for prototype or moderate volume production. •The overlay can be removed and replaced without chip damage. •Chips are mounted directly on the substrate for good heat dissipation.

13 citations

Proceedings ArticleDOI
07 Aug 2002
TL;DR: In this paper, a flex-circuit power packaging platform that enables integration of power dies and control components with an advantageous form factor has been presented, and a half-bridge test vehicle has been designed and fabricated for automotive applications.
Abstract: This paper presents a novel flex-circuit power packaging platform that enables integration of power dies and control components with an advantageous form factor. The flex-circuit offers the benefits of planar interconnection and multilayer layout design flexibility with reduced parasitic inductance compared to conventional wire bonds. A half-bridge test vehicle that implements the flex-circuit packaging platform has been designed and fabricated for automotive applications (42 V, 16 A). The power flex module presents a compact configuration with electrical results indicating improved package parasitics.

13 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202331
202293
202160
2020102
2019114
201896