Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Abstract: Power electronics building blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double what could be achieved with commercially packaged devices of the same rating.

The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask

Abstract: A nanosecond-pulsed laser bonding process with a shadow mask for MEMS packaging applications has been successfully demonstrated. YAG Surelit II laser with pulse duration of 4–6 ns, a wavelength of 355 nm and a focal diameter of 1 mm is used to provide the bonding energy for glass-to-silicon bonding using a 4 μm thick indium layer as the bonding material. The optimal bonding parameters are found experimentally when the laser energy is between 8 and 22 mJ and multiple laser shots are used. Furthermore, a regular white paper with pre-defined patterns has been successfully used as the masking material to achieve selective heating and bonding. Simulation results show that localized heating can be achieved by using the nanosecond laser. One micro-second after the laser power is applied, the temperature at the indium/silicon interface drops from 2500 to 760 °C and drops further to 43 °C after 1 ms. This nanosecond laser power is believed to provide suitable energy and time for localized heating and bonding applications for MEMS.

Power electronic module packaging

Abstract: A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure is attached to a carrier frame, and a via pattern is formed in the membrane. Power devices are aligned and attached to the planar membrane structure; a top layer interconnect structure is formed by metalizing the vias and the film; and a circuit is formed by patterning a deposited metal layer. The carrier frame is removed, and upper and lower thermal base plate sub-assemblies are attached to the power device-on-membrane structure. The planar device-on-membrane structure accommodates different types of power devices having variations in thickness. The thermal base plate sub-assemblies may include integral, high-performance heat exchangers for providing a low thermal resistance path to the ambient.

Challenges in interconnection and packaging of microelectromechanical systems (MEMS)

Abstract: Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure. This is not true for MEMS with respect to packaging and testing. It is more difficult to adopt standardized MEMS device packaging for wide applications although MEMS use many similar technologies to IC packaging. Packaging of MEMS devices is more complex since in some cases it needs to provide protection from the environment while in some cases allowing access to the environment to measure or affect the desired physical or chemical parameters. Microscopic mechanical moving parts of MEMS have also their unique issues. Therefore, testing MEMS packages using the same methodologies, as those for electronics packages with standard procedures might not always be possible especially when quality and reliability need to be assessed. Single MEMS chip packaging approaches and their limitations in the packaging of high performance MEMS will be reviewed in this presentation and also identifies a need for a systematic approach for this purpose. MEMS package reliability depends on package type, i.e. ceramic, plastic, or metal, and reliability of device. The MEMS device reliability depends on its materials and wafer level processes and sealing methods used for environmental protection. MEMS quality and reliability challenges are discussed and needs for study in these areas are identified.

Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages

Abstract: In this paper, terahertz (THz) characterization of dielectric substrates, THz planar and quasi-optical components, THz probing of planar devices, and THz nondestructive evaluation (NDE) are demonstrated. In particular, the goals of this paper are: 1) characterization of dielectric substrates for THz packaging applications; 2) design, fabrication, and evaluation of THz components built using some of these dielectric substrates; and 3) the use of the dielectric characterization approach and dielectric properties in NDE of electronic packages. The background theory for characterizing dielectric substrates using THz time-domain signals is provided. The Nelder and Mead modified simplex optimization algorithm is utilized in order to extract the dielectric properties of different packaging materials encompassing organic, inorganic, and composite materials. A planar THz power splitter, a dielectric probe, and a low-cost polymer-based quasi-optical band-stop interference filter are demonstrated. THz NDE of electronics packages is demonstrated for packaging delamination and moisture ingression in dielectric films.