Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Conjugated and Fullerene-Containing Polymers for Electronic and Photonic Applications: Advanced Syntheses and Microlithographic Fabrications

Abstract: Polymers have traditionally been used for so-called passive applications in many areas of electronics, for instance, as passivation and insulating materials in electronic packaging and as lithograp...

Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging

Abstract: Thermal management plays a very vital role in the packaging of high performance electronic devices. Effective heat dissipation is crucial to enhance the performance and reliability of the packaged devices. Liquid encapsulants used for glob top, potting, and underfilling applications can strongly influence the package heat dissipation. Unlike molding compounds, the filler loading in these encapsulants is restrained. This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. A comparative study on the effect of different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant is presented.

Recent advances in nano-materials for packaging of electronic devices

Abstract: In recent years, Moore’s law had a remarkable effect on predicting the development of semiconductor technology. As the size of devices shrinks to micro scale or nano scale, Intel’s newest 10-nm logic technology is scheduled to start product shipments before the end of 2017. Moore’s law will not die out, as the research scale reaches the atomic scale, “new devices” and new interconnection methods are urgently needed. In this paper, based on emerging interconnection requirement, the contribution to the advanced electronic packaging containing novel nano-materials, such as the carbon nanotubes, nanoparticles sintering, interconnection of nano-solder, nano-silver and surface plasma nano-welding are discussed. For the next 5–10 years, two new types of interconnect solutions are gaining attentions: solder joint alternatives and Cu electrode alternatives. The former uses new materials such as graphene, carbon nanotubes and nanowires to replace traditional solder joints. The latter uses optical media to replace the traditional Cu metal. In general, advanced materials will make more and more outstanding contributions in the development of electronic packaging in the next 10–20 years.

Electronic packaging module utilizing phase-change conductive cooling

Abstract: Each individual module includes a sealed chamber containing the electronic components being cooled, the liquid cooling medium, and at least one minature evaporator. The evaporator's outer surface area is in direct contact with the cooling medium, so as to maintain it at a desired temperature. Preferably, in order to minimize the weight associated with the liquid cooling medium and in order to compensate for its coefficient termal expansion and the associated internal pressure variation, the chamber may be packed with resilient spheres that will displace a substantial quantity of the cooling medium without a corresponding increase in its effective viscosity (and thus without any substantial effect on the liquid's capability of transferring heat from the components to the evaporator by means of thermal convection currents). The mechanical, electrical and refrigerant connections between the module and the other assemblies of the avionics system are such that the individual module may be readily removed and replaced thereby further enchancing the overall maintainability of the system. An expansion bladder vented to the external environment may also be provided within the chamber.