Topic
Electronic packaging
About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.
Papers published on a yearly basis
Papers
More filters
TL;DR: In this paper, thermal analysis of three kinds of ceramic package designs for high power LEDs was made by transient thermal measurement and thermal simulation using the Finite Volume Method, and the results showed that the junction temperature decreases with the effective contact area ratio in the LED packages.
75 citations
TL;DR: In this paper, the three-dimensional carbon fiber (CF)-MXenes foam, in which the vertically aligned CF constructed the heat transport paths, were prepared by simple freeze-drying method.
75 citations
TL;DR: Yang et al. as mentioned in this paper developed a polymer composite material with high dielectric constant based on the mechanism of interfacial polarization, although they need precision filler concentration control to achieve high reliability and low processing temperature.
Abstract: Metal nanoparticles exhibit a number of interesting characteristics, including unique physical, chemical, optical, magnetic, and electric properties. Numerous investigations have exploited their properties in a readily usable form by incorporating them into polymers. The current focus of interest is the behavior of such polymer nanocomposites near the percolation loading levels of the metal nanoparticles. This material is particularly suitable for the new integral passive technology. Discrete capacitors are used in many applications, such as noise suppression, filtering, tuning, decoupling, bypassing, termination, and frequency determination, and they occupy a substantial amount of surface area on a substrate. Thus there are limitations in the number of capacitors that can be placed around the chip. Integral passive components are gradually replacing discrete components because of the inherent advantages of improved electrical performance, increased real estate on the printed wiring board, miniaturization of interconnect distance, reduced processing costs, and efficient electronics packaging. For integral capacitors, polymer composite material has emerged as a potential candidate because it meets the requirements of low processing temperature and reasonably high dielectric constant. Yang and Wong, whose patent was filed in 2001, demonstrated novel integral passive component materials with extraordinarily high dielectric constants (K > 1000) and high reliability performance. These materials are characterized by high dielectric constant based on the mechanism of interfacial polarization, although they need precision filler concentration control. The current study overcomes this drawback and produces the composite through an in situ reduction in an epoxy matrix. Material characterization was done through TEM, SEM, X-ray analysis, and energy-dispersive analysis for X rays. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 1531–1538, 2004
75 citations
74 citations
Patent•
19 Jul 1994TL;DR: In this paper, a leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps, and the metallic strip is then etched from the opposite side to forming individual leads.
Abstract: There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.
74 citations