Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Antenna-in-Package in LTCC for 60-GHz Radio

Abstract: An IEEE standards group, 802.15.3c, is defining specifications for 60-GHz radio to use the 7 GHz of unlicensed spectrum to enable very high-data-rate applications such as high-speed Internet access, streaming content downloads, and wireless data bus for cable replacement. An antenna plays a key role in a radio as it has independent properties that affect the radio as a whole. Antenna designs for radio operating at 60 GHz or above are turning to antenna-on-chip (AoC) and antenna-in-package (AiP) solutions. In this paper we present the design, fabrication, and characterization of two novel AiPs in ceramic ball grid array packages using low temperature cofired ceramic (LTCC) technology for 60-GHz radio. LTCC process can embed high-quality passives in low loss ceramic substrates, while allowing active devices to be mounted on/in them. The LTCC process produces mechanically strong, hermetically sealed, thermally conductive, chemically inert, and dimensionally stable structures with high yield. Therefore, the LTCC process has recently been added to the narrow list of technologies capable of realizing millimeter-wave wireless systems

Configurable Three‐Dimensional Boron Nitride–Carbon Architecture and Its Tunable Electronic Behavior with Stable Thermal Performances

Abstract: Recent developments of 3D-graphene and 3D-boron-nitride have become of great interest owing to their potential for ultra-light flexible electronics. Here we demonstrate the first synthesis of novel 3D-BNC hybrids. By specifically controlling the compositions of C and BN, new fascinating properties are observed, such as highly tunable electrical conductivity, controllable EMI shielding properties, and stable thermal conductivity. This ultra-light hybrid opens up many new applications such as for electronic packaging and thermal interface materials (TIMs).

The finite-element method for modeling circuits and interconnects for electronic packaging

Abstract: A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.

Packaging for microelectromechanical and nanoelectromechanical systems

Abstract: Packaging is a core technology for the advancement of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS). We discuss MEMS packaging challenges in the context of functional interfaces, reliability, modeling and integration. These challenges are application-dependent; therefore, two case studies on accelerometers and BioMEMS are presented for an in-depth illustration. Presently, most NEMS are in the exploratory stage and hence a unique path to identify the relevant packaging issues for these devices has not been determined. We do, however, expect the self-assembly of nano-devices to play a key role in NEMS packaging. We demonstrate this point in two case studies, one on a silicon nanowire biosensor, and the other on self-assembly in molecular biology. MEMS/NEMS have the potential to have a tremendous impact on various sectors such as automotive, aerospace, heavy duty applications, and health care. Packaging engineers have an opportunity to make this impact a reality by developing low-cost, high-performance and high-reliability packaging solutions.