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Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.


Papers
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06 Mar 2012
TL;DR: In this article, a comparison of diffusion bonding and sintering silver particles for chip-to-substrate interconnects is presented, with respect to their applicability for power electronics packaging.
Abstract: Higher operation temperatures and the current density increase of new IGBT generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon leads to maximum operation temperatures of nearly 200 deg C. As a result new packaging technologies are needed to face the demands of power modules in the future. In case of the chip-to-substrate interconnect basically two technology trends for an improved die attach procedure became visible. On the one hand diffusion bonding has been presented, where the joint is formed from high melting intermetallics. On the other hand the chip-to-substrate interconnect can be realized by sintering silver particles, resulting in a monometallic porous die attach layer. This paper presents a comparison of these two technology trends with respect to their applicability for power electronics packaging.

50 citations

Journal ArticleDOI
TL;DR: In this article, the authors present a method upon which the fluid properties and their influence on the dispensing process can be readily identified from a few measurements of the process, which is proven to be not only cost and time effective but also promising for the investigation into the effects of fluid properties on the dispensed process.
Abstract: The fluid dispensing process has been widely employed in electronics packaging manufacturing to deliver fluid materials (such as epoxy, encapsulant, adhesive) on substrates or printed circuit boards (PCBs) for the purpose of die attachment, encapsulation, coating, or surface mounting. In this process, the fluid properties such as How behavior, surface tension, and contact angle can have a significant influence on the How rate of the fluid dispensed and the profile of fluid formed on the substrate or PCB, thereby affecting the quality of electronics packaging. At present, massive measurements are always required to characterize the fluid properties by using specific instruments, and the procedure of measuring is time-consuming. This paper presents a method upon which the fluid properties and their influence on the dispensing process can be readily identified from a few measurements of the process. By experiments, this method was proven to be not only cost and time effective but also promising for the investigation into the effects of fluid properties on the dispensing process.

49 citations

Proceedings ArticleDOI
07 Aug 2002
TL;DR: In this article, the authors proposed a new method of transient response analysis by utilizing implicit-based FEM code NASTRAN to drop the calculation cost of impact study, which can accurately simulate the dynamic behavior of BGA packaging including the time histories of the deformations and stresses, and it can drop the CPU time to about one tenth of that of LS-DYNA analysis.
Abstract: Clarifies the dynamic behavior of BGA or CSP packaging subjected to an impact loading, and establishes a simple analytical method of impact reliability assessment for solder joints. In order to take dynamic material properties into account, a high deformation speed tension test and a vibration test were carried out to obtain the strain rate dependence of yield stress and Young's modulus of solder materials and PCB. A 3-D analytical model of PCB mounted with a BGA chip was used to simulate the impact behavior of BGA packaging, and explicit-based FEM code LS-DYNA was used to carry out the dynamic analysis. It was found that the impact reliability of solder joints is greatly affected by the falling posture. However, it was found that fine meshing of solder joints causes a rapid augmentation of calculation cost. In this study, the authors proposed a new method of transient response analysis by utilizing implicit-based FEM code NASTRAN to drop the calculation cost of impact study. It was shown that the present method can accurately simulate the dynamic behavior of BGA packaging including the time histories of the deformations and stresses, and it can drop the CPU time to about one tenth of that of LS-DYNA analysis.

49 citations

Journal ArticleDOI
Johan Liu1
TL;DR: Polymeric packaging in electronics is shown to be playing a significant role in electronics manufacturing that will become of increasing importance with many more applications anticpated in the future as discussed by the authors, and future challenges, problems, and trends are also discussed.
Abstract: Poly-meric electronic packaging u.sing conductive adhesives is expected to become a key technology for the assembly and manufacturing of electronics. It offers many advantages compared with conventional leadsolder based technology including lower processing temperature, environmental compatibility, simpler processing, and lower cost. Achievements worldwide in polymeric electronic packaging using conductive adhesives for electronics manu.facttlling at re earch institutes, universities, and electronic manufacturers are described. Particular note is made of R&D in the United States, in central Europe, and in the Scandinavian countries. Future challenges, problems, and trends are also discussed. Polymeric packaging in electronics is shown to be playing a significant role in electronics manufacturing that will become of increasing importance with many more applications anticpated in the future.

49 citations

Patent
18 May 1999
TL;DR: In this article, a device for electrically interconnecting and packaging electronic components is described, where a nonconducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided.
Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices. In another aspect of the invention, the device includes a series of specially shaped through-holes are provided within the base member to allow the routing of wire leads there through. The bottom surface of the base member is chamfered to facilitate “wicking” of molten solder up the wire leads during soldering, thereby allowing for a stronger and more reliable joint. A method of fabricating the device is also disclosed.

49 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202331
202293
202160
2020102
2019114
201896