Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Quilt Packaging: High-Density, High-Speed Interchip Communications

Abstract: ldquoQuilt packagingrdquo (QP), a new superconnect paradigm for interchip communication, is presented. QP uses conducting nodules that protrude from the vertical facets of integrated circuits to effect a dense, fast, and reduced-power method of interfacing multiple die together within a package or on a multichip module. The concept of QP is presented along with a discussion of advantages over traditional system-on-chip and other system-in-package technologies. A process flow and results of chip fabrication are detailed. Simulations show expected signal propagation between adjacent die of greater than 200 GHz, and measurements of interconnected chips confirming low losses and resonance-free operation to at least 40 GHz have been achieved.

Feasibility of surface activated bonding for ultra-fine pitch interconnection-a new concept of bump-less direct bonding for system level packaging

Abstract: In the present study a method of ultra-high density interconnection, the surface activation (SAB) method is introduced. Also for the next generation of packaging, which might bridge to global interconnection on chip, a concept of bump-less bonding is proposed. The bumpless bonding will be especially suitable and inevitable for ultra-high density interconnection when it will convert the range of /spl mu/m size. For such bonding requires at the same time, combinations of a ultra-thin chip and a flexible substrate. The surface activated bonding method enables the metals and non-metallic materials to be bonded at room temperature only by contact. Some fundamental experiments and preliminary results of examination of the feasibility of the method for Cu and Cu direct bonding are presented.

Electronic packaging reflow shape prediction for the solder mask defined ball grid array

Abstract: The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joint has drawn special attention in the development of electronic packaging for its practical engineering application. Many solder joint models have been developed based on energy minimization principle (Patra et al, 1995) or analytical method (Heinrich et al, 1993, Liedtke 1993). These methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method in real application. In this study, an efficient numerical method used to predict the shapes of solder joint is investigated and the results are compared with Surface Evolver program. The changes of geometric shape with respect to different parameters of solder joint are also discussed in this paper. The influences of the geometric parameters such as volumes of solder joint, package weight, contact angles, pads sizes, solder surface tension, and gravity forces to the shape of solder joint are investigated. Results presented in this study can be used to determined the optimal balanced stand-off height of Single Ball Module (SBM) or Multiple Ball Module (MBM) solder joint models.

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

Abstract: The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy‐based underfills are often employed in flip‐chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next‐generation IC chips with much higher power density. Many strategies have been proposed to improve the thermal conductivity of epoxy, but its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal–electrical–mechanical–processing properties of underfill materials for flip‐chip packaging remains a great challenge. Herein, state‐of‐the‐art advances that have been made to satisfy the key requirements of capillary underfill materials are reviewed. Based on these studies, the perspectives for designing high‐performance underfill materials with novel microstructures in electronic packaging for high‐power density electronic devices are provided.

Manipulating Orientation of Silicon Carbide Nanowire in Polymer Composites to Achieve High Thermal Conductivity

Abstract: Highly thermally conductive polymer composites have received considerable attention, along with development of electronic devices toward being more integrated, miniaturized, and functionalized. However, traditional polymer composites cannot meet the requirement of achieving higher thermal conductivity at relatively low filler loading. Herein, manipulating orientation of silicon carbide nanowire (SiCNW) in epoxy composites by coating method is reported to achieve high in-plane thermal conductivity (10.10 W m−1 K−1) at extremely low filler loading (5 wt%), while it is only 1.78 and 0.30 W m−1 K−1 for epoxy/random SiCNW composite and epoxy/silicon carbide nanoparticle composite. Several models are employed to demonstrate that a good orientation and high aspect ratio of SiCNWs contribute to form heat transfer networks in the composites. This provides a promising future for thermal-management materials, which are widely applied to electronic packaging, aerospace field, and medical engineering.