Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and two-dimensional materials, and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including radio frequency (RF) electronics and neuromorphic computing. [DOI: 10.1115/1.4049293]

Double surface mount technology for electronic packaging

Abstract: A novel printed circuit board is disclosed. The printed circuit board has a high density of circuit components with lower circuit components residing within recesses in a printed wiring board and upper circuit components residing above the lower circuit components.

Mechanics of interface with applications in electronic packaging

Abstract: The purpose of this paper is to present a brief review of the mechanics of interface fracture, with a focus on applications in electronic packaging. From a structural mechanics perspective, electronic devices can be thought of as composite structures fabricated from highly dissimilar materials. Often, the interfaces between these materials are where failure is most likely to occur when the device is subjected to thermomechanical loading. The mechanics of interface fracture is a specialized subtopic within the discipline of fracture mechanics and the nonspecialist may be unaware of some of the subtle differences encountered in applying interface fracture concepts. The mechanics associated with interface fracture introduces certain mathematical concepts that may seem to be unnecessarily complicated, but are essential for its proper application. It is important that the electronic packaging reliability engineer be aware of these concepts, understanding the most important implications. This review will focus on the mechanics and computational aspects of interface fracture in electronic structures, with a particular emphasis on some details that the nonexpert could only obtain after an extensive review of the available literature. Numerical results are presented for the important problem of corner cracking between silicon and epoxy materials subjected to thermomechanical loading. These new results provide insight into the three-dimensional nature of interfacial crack propagation at bimaterial corners.

Modern Approaches to Fatigue Life Prediction of SMT Solder Joints

Abstract: Surface mount technology (SMT) has been widely adopted in recent years, brought on by the need to produce small, dense electronic packaging. This technology has many advantageous characteristics: SMT allows for components to be mounted on both sides of the board. Holes through the board are only needed for communication between the surface and the circuit planes; thus the size of the holes can be decreased. Since less room is needed for holes, a 50 percent increase in line density from a similar through-hole board can be obtained.’