Topic
Electronic packaging
About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.
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42 citations
TL;DR: In this article, a method of bonding superconductive integrated-circuit chips to interchangeable, microwave-compatible, flexible cryo-packages was proposed to reduce the degradation and variation of the contact resistances of the chip pads due to mechanical wear.
Abstract: We have developed a method of bonding superconductive integrated-circuit chips to interchangeable, microwave-compatible, flexible cryo-packages. This "flip-chip on flex" technology will greatly improve the service life and reliability of our Josephson systems because the present press-contacts to the chip are replaced with directly soldered connections. The new method eliminates the most common failure mode for our Josephson chips, which has been the degradation and variation of the contact resistances of the chip pads due to mechanical wear upon repeated thermal cycles from 4/spl deg/K to room temperature. The superior microwave properties of this packaging provide improved operating margins for our devices. We have demonstrated the reliability of the bonds with repeated thermal cycling for 100% operational chips with 40 connections (67 410 Josephson junctions).
42 citations
TL;DR: The effort to predict delamination related IC & packaging reliability problems is presented, and several reliable non-linear Finite Element models are developed, able to predict the reliability impact of delamination on wire failures, different package structures, and passivation cracks in IC-packages.
42 citations
TL;DR: In this paper, a low-cost, wafer-level packaging of microelectromechanical systems (MEMS), e.g., microresonators, is reported.
Abstract: An approach to low-cost, wafer-level packaging of microelectromechanical systems (MEMS), e.g., microresonators, is reported. The process does not require wafer-to-wafer bonding and can be applied to a wide range of MEMS devices. A sacrificial polymer-placeholder is first patterned on top of the MEMS component of interest, followed by overcoating with a low dielectric constant polymer overcoat. The sacrificial polymer decomposes at elevated temperature, and the volatile products from the sacrificial material permeate through the overcoat polymer leaving an embedded air-cavity around the MEMS structure. Thus, the device is released from the sacrificial polymeric material, housed in a protective overcoat. The protected MEMS device can then be handled and packaged like an integrated circuit. The electrical characteristics of the microresonators before and after packaging were essentially the same, showing the packaging scheme does not alter the device performance. This approach is applicable to both surface and bulk micromachined devices
42 citations