Topic
Electronic packaging
About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.
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TL;DR: In this article, the failure of the solder joints is attributed to the failure due to the defect of the soldering process of the joints. But due to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging.
Abstract: Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the ...
37 citations
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TL;DR: Chip-scale packaging technology is still taking its first steps into the marketplace, and issues of standards, design, and reliability remain to be solved as mentioned in this paper, however, an infrastructure for the technology is beginning to develop, and its potential market seems to be guaranteed, not least by consumer thirst for portable electronic applications, for which the small, light package is a natural.
Abstract: Uniting the advantages of bare die and mainstream packaging, these minimal IC supports are racing to the aid of portable yet powerful products. Rigorously defined, the perimeter of such a package is no more than 1.2 times the perimeter of the die it contains, so that few other IC packages are any smaller. This reduction in size is the key driver of the popularity of the approach. But because the term chip-scale has a marketing value, some manufacturers have extended it to cover other sizes, too. Chip-scale packaging technology is still taking its first steps into the marketplace, and issues of standards, design, and reliability remain to be solved. Even so, an infrastructure for the technology is beginning to develop, and its potential market seems to be guaranteed, not least by consumer thirst for portable electronic applications, for which the small, light package is a natural.
37 citations
TL;DR: In this article, a novel thermal interface materials using Ag-doped Ga-based liquid metal were proposed for heat dissipation of electronic packaging and precision equipment, which can effectively decrease the CPU temperature and change the heat flow path inside the smart-phone.
Abstract: Novel thermal interface materials using Ag-doped Ga-based liquid metal were proposed for heat dissipation of electronic packaging and precision equipment. On one hand, the viscosity and fluidity of liquid metal was controlled to prevent leakage; on the other hand, the thermal conductivity of the Ga-based liquid metal was increased up to 46 W/mK by incorporating Ag nanoparticles. A series of experiments were performed to evaluate the heat dissipation performance on a CPU of smart-phone. The results demonstrated that the Ag-doped Ga-based liquid metal pad can effectively decrease the CPU temperature and change the heat flow path inside the smart-phone. To understand the heat flow path from CPU to screen through the interface material, heat dissipation mechanism was simulated and discussed.
37 citations
20 Jul 2003
TL;DR: In this paper, an in-situ PVDF piezoelectric force sensing during microassembly and packaging process has been proposed to allow close monitoring of magnitude and direction of forces (adhesion, surface tension, friction and assembly force) acting on micro devices during manipulation.
Abstract: This paper aims at advancing micromanipulation technology with in-situ PVDF piezoelectric force sensing during microassembly and packaging process. To allow close monitoring of magnitude and direction of forces (adhesion, surface tension, friction, and assembly force) acting on micro devices during manipulation, the polyvinylidene fluoride (PVDF) is used to fabricate highly sensitive 1-D and 2-D sensors for assembly of micro devices. By using an electronic circuit designed with the effective data processing techniques, the contact/impact force signal can be obtained desirably and then is fed back for improving the reliability of assembly. The calibration of the sensor has been conducted on a high precision optical microscope system with the optimal image processing methods. Preliminary calibration results verify the effectiveness of the sensor model with high sensitivity as well as a resolution in the range of sub-/spl mu/N. Furthermore, experiments demonstrate the performance of the force sensing system. Ultimately the technology will provide a critical and major step towards the development of automated manufacturing processes for batch assembly of micro devices.
37 citations
TL;DR: In this paper, the influence of the die attach process on the electromechanical behavior of doubly-anchored surface micromachined beams has been analyzed and the results of parametric studies on the effects of die attach on the pull-in behavior of beams of various lengths, widths, and anchor types are presented.
Abstract: The thermal cure required for die attach during microelectro-mechanical systems (MEMS) packaging causes thermal mismatch that induces undesirable stresses and strains in surface micromachined structures, which may adversely affect the performance and reliability of the packaged component. Understanding the influence of the packaging process is, therefore, critical for successful device design. This paper analyzes the influence of the die attach process on the electromechanical behavior of doubly-anchored surface micromachined beams. A number of different adhesive materials were considered, and the results of parametric studies on the effects of die attach on the pull-in behavior of beams of various lengths, widths, and anchor types are presented. An upward shift in pull-in voltage of the studied devices was observed in both simulation and experiment; modelled and measured data were found to correlate closely.
37 citations