Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Packaging and interconnection of sensors

Abstract: Chip mounting methods, chip-substrate interconnection techniques, encapsulation processes, design methods and technologies for multi-chip systems must all be considered in microelectronic packaging. In the case of sensors, as well as the electrical contacts for signal outputs and power distribution, the input of the non-electrical measurement signals must be realized. Parts of the sensor are therefore in direct contact with environmental physical and chemical parameters which can degrade the reliability. Therefore the requirements for sensor packaging technologies are related to specific measurement problems. In general, sensor packaging has to deliver reliable, economical and application-oriented solutions by choosing optimal technologies and material combinations.

Flexible tape electronics packaging

Abstract: To decrease the weight and the thickness, and to increase the flexibility, of an electronics package, the package includes an integrated circuit (IC) mounted on a flexible tape substrate. In one embodiment, an IC is mounted on a flexible tape substrate using a ball grid array arrangement; however, other arrangements, including lead bonding, can be used. The flexible tape substrate can comprise conductive traces, vias, and patterns of lands on one or more layers. Methods of fabrication, as well as application of the flexible tape package to an electronic assembly, an electronic system, and a data processing system, are also described.

Compact packaging of optical and electronic components for on-board optical interconnects

Abstract: An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are formed on the top surface of the substrate, and polymer waveguide array with 45/spl deg/ mirror planes is formed on the back side. This optical interconnection plate technique makes the alignment procedure quite simple and economical, because all the alignment steps between the optical components can be achieved in wafer processes and a high accuracy flip-chip bonding technique. We confirmed the sufficiently high coupling efficiency and low optical crosstalk using the simplified experimental setup. Flip-chip bonding of the vertical-cavity surface-emitting laser and photodiode arrays on the top surface of the optical interconnection plate was performed using indium bumps in order to avoid thermal damage of the polymer waveguide. The fully packaged optical interconnection plate showed an optical data link at rates of 455 Mb/s. Improvement of the mirror surface roughness and the mirror angle accuracy could lead to an optical link at higher rates. In addition, the interconnection system can be easily constructed by inserting the optical interconnection plate between the processing chips or data lines requiring optical links.

Packaging a fiber Bragg grating with metal coating for an athermal design

Abstract: This paper presents an athermal package to compensate for temperature deviation of a fiber Bragg grating (FBG) with a metal coating. The metal coating is electroless plated onto the optical fiber to function as a thermal compensator. From the cross section of a thermal compensator used for FBG athermal package, an optical fiber and a metal coating appear. Therefore, in theory, the two-phase constant model is applied in designing the metal coating thickness associated with the effective thermal expansion coefficient and the effective Young's modulus in the composite thermal compensator. As a result, the total variation of Bragg wavelength over the temperature ranging from 30 to 80/spl deg/C is around 0.05 nm in a new package based upon the concept of a bimaterial device. To the authors' knowledge, the configuration proposed in this paper is probably the simplest bimaterial package design there is.

High density packaging of X-band active array modules

Abstract: A new high-density package design has been used to reduce the cost, weight, and size of X-band active array radars. The package used multilayer aluminum nitride (AlN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnects. This paper discusses the design tradeoffs, the package construction and assembly, and test results.