Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

Electronic Packaging Materials and Their Properties

Abstract: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications

Abstract: New interconnect materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. Polymer-based conductive-adhesive materials have become widely used in many electronic packaging interconnect applications. Among all the conductive-adhesive materials, the anisotropic conductive adhesives (ACA) (or anisotropic conductive adhesive films, ACF) have gained popularity as a potential replacement for solder interconnects. The interest in using ACA instead of solder comes partly from the fact that the use of ACA for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging) offers numerous advantages such as reduced thickness, improved environmental compatibility, lowered assembly process temperature, increased metallization options, reduced cost, and decreased equipment needs. In this review, a summary of our understanding of the electrical, physical, thermal, chemical, environmental, and cost behaviors of ACA in conjunction with various packaging applications is elaborated. First, the formulation and curing kinetics of ACA materials, as well as the conduction mechanisms of ACA joints, are introduced; second, the influencing factors, including the boding process (boding temperature, boding pressure, curing conditions, reflow and misalignment processes, etc), the environmental factors (temperature, humidity, impact load, etc), and the properties of the components (the properties of the ACA, substrates, conductive particles, the bump height, etc), on the reliability of ACA joining technology are presented. Finally, future research areas and remaining issues are pointed out. The purpose is simply to pinpoint the most important papers that have played significant role for the advancement of the ACA bonding technology.

Characterization of liquid crystal polymer for high frequency system-in-a-package applications

Abstract: Liquid crystal polymer (LCP) is a promising substrate for electronics packaging. In this paper, the high frequency characteristics of LCP were investigated using a microstrip ring resonator to verify the possibility of applying the material in RF packaging. The relative dielectric constant and the loss tangent have been measured. The radiation loss of the ring is considered to accurately determine the loss tangent. A GaAs MMIC switch circuit was fabricated using LCP as substrate to demonstrate the application of this material for system-in-a-package. From the high frequency measurements, it is shown that LCP has low dielectric constant and low loss tangent in the frequency range from 1 GHz to 35 GHz. It is also found that LCP can be used in system-in-a-package applications.