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Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.


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Patent
David Hartke, J. DiBene1
04 Mar 2003
TL;DR: In this article, the assembly includes a mother board having a processor carrier and a heat sink is thermally coupled to the processor carrier, and a voltage regulating module board is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.
Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.

28 citations

Journal ArticleDOI
TL;DR: The kinetics of pyrolysis of electronic packaging material are investigated under various heating rates (5, 10, 15, 20 K/min) in an inert atmosphere using a thermogravimetric analysis (TGA) technique and the results will be useful in developing pyroglysis or incineration systems for plastic waste from electronic components.

28 citations

Journal ArticleDOI
TL;DR: In this article, the authors describe new spring contacts which simultaneously achieve low resistance ( ; 30 μm) in dense 2-D arrays (180 ~ 180-μm pitch) and demonstrate that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
Abstract: Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( ; 30 μm) in dense 2-D arrays (180 ~ 180-μm pitch). Mechanical characterization shows that individual springs operate at approximately 150-μN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is <; 40 mΩ . A daisy-chain test die consisting of 2844 contacts is assembled into flip-chip packages with 100% yield. Thermocycle and humidity testing suggest that packages with or without underfill can have stable resistance values and no glitches through over 1000 thermocycles or 6000 h of humidity. This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.

28 citations

Proceedings ArticleDOI
17 Mar 2013
TL;DR: In this article, the top side interconnects are achieved by using three innovative solutions: a sinterable top metallization, a metal buffer plate joined on top of the chip metallisation (Danfoss Bond Buffer - DBB), and finally heavy Copper wire bonds.
Abstract: An increase in reliability and lifetime for power semiconductors at the same or lower cost and with the potential for higher power density remain high on the wish list for many Power Electronics Engineers. Power semiconductors continuously improve in current density year over year. However, without parallel enhancements in the thermal stack and the associated bonding and joining technology, significant limitations in harvesting these improvements remain. This is especially true when looking at the potential of SiC or GaN semiconductors where higher operating and switching temperatures are limited only by the available packaging technology. This paper presents a solution for a highly reliable power module concept. It is based on interconnect technology with outstanding reliability while maintaining the so desired design flexibility. For the presented solution, die attach is performed by a low pressure sintering process. The top side interconnects are achieved by using three innovative solutions: a sinterable top metallization, a metal buffer plate joined on top of the chip metallization (Danfoss Bond Buffer - DBB) and finally heavy Copper wire bonds.

28 citations

Proceedings ArticleDOI
05 Dec 2000
TL;DR: An overview is given of trends in electronic packaging and assembly for portable consumer products, with the focus on thinner and smaller packages with a higher lead count and integrated passive components in CSP format.
Abstract: In this paper, an overview is given of trends in electronic packaging and assembly for portable consumer products. With regard to components, the focus is on thinner and smaller packages with a higher lead count. To save board space, integrated passive components in CSP format are being developed. The use of modules that provide a complete function is increasing. Advantages are flexibility, diversity, and cheaper and simpler second-level assembly (the high-density interconnect is limited to the interior of the module). Both motherboards and interposer substrates (used in packages and modules) are characterised by smaller features to accommodate higher I/O density, and reduced thickness to limit the overall electronic assembly height. For the same reasons, techniques and materials have been developed to enable embedded passives. New substrate materials have been developed with better electrical and thermal behaviour to comply with RF requirements. In assembly processes, package assembly is done increasingly at wafer or substrate level to save costs, increase production volume, and facilitate package miniaturisation. Standard reflow soldering is optimised to enable the integration of CSPs and flip-chips on the motherboard. In some areas, conductive adhesive is used, e.g. to get smaller bump pitches on flip-chips. Finally, due to market demand and legislation, assembly processes, components, and materials must be adapted to realise environmentally friendly products. Special attention is paid to the elimination of lead, volatile organic compounds, and halogens.

28 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202331
202293
202160
2020102
2019114
201896