Electronic packaging

About: Electronic packaging is a research topic. Over the lifetime, 3977 publications have been published within this topic receiving 48510 citations.

High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging

Abstract: This paper proposes an innovative process combining the electroforming of high-density and through-wafer copper interconnections and solder bumps for advanced MEMS packaging. Vias with the diameter of 30 to 100 μm were etched through on a 4-inch and 550 μm-thick silicon substrate by ICP-DRIE process for an aspect ratio up to 18.3. MRTV1 silicon rubber layer was employed for substrates quickly releasing after copper-interconnections electroforming. Compared to the tedious wet etching or mechanical polishing process, this peel-off relasing process provides a simpler way. After another lithography process, mushroom shape eutecic solder bumps (63Sn/37Pb) were directly electroformed on the top of each copper interconnection with the height of 100 μm, and reflowed at 200 °C for 5 min to form solder spheres. The feasibility of making highly dense and uniform electrical interconncetions has been successfully demonstrated on the wafer with fabricated micro temperature sensors. The estimated resistance for the copper-column of different diameters are characterized lower than 13.1 mΩ and this process provides a bump density up to 9648 interconnects/cm2.

Telescoping Solar Array Concept for Achieving High Packaging Efficiency

Abstract: Lightweight, high-efficiency solar arrays are required for future deep space missions using high-power Solar Electric Propulsion (SEP). Structural performance metrics for state-of-the art 30-50 kW flexible blanket arrays recently demonstrated in ground tests are approximately 40 kW/cu m packaging efficiency, 150 W/kg specific power, 0.1 Hz deployed stiffness, and 0.2 g deployed strength. Much larger arrays with up to a megawatt or more of power and improved packaging and specific power are of interest to mission planners for minimizing launch and life cycle costs of Mars exploration. A new concept referred to as the Compact Telescoping Array (CTA) with 60 kW/cu m packaging efficiency at 1 MW of power is described herein. Performance metrics as a function of array size and corresponding power level are derived analytically and validated by finite element analysis. Feasible CTA packaging and deployment approaches are also described. The CTA was developed, in part, to serve as a NASA reference solar array concept against which other proposed designs of 50-1000 kW arrays for future high-power SEP missions could be compared.

Electronic packaging and method of packaging

Abstract: Protective packaging for electronic equipment includes an expanded foam body with cavities for components, air ducts, and the like. An outer EMI bag surrounds the equipment containing foam body. The assembly is enclosed within a deformable exterior case which includes front and rear covers, air filters, or fans. The cases are modular and stackable. Integrally formed connectors electrically couple adjacent cases together. The connectors couple the EMI bags together to form a common shield.