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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
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Journal ArticleDOI
TL;DR: In this article, the authors investigated the behavior and heat transfer enhancement of a particular nanofluid, Al2O3 nanoparticle-water mixture, flowing inside a closed system that is destined for cooling of microprocessors or other electronic components.

575 citations

Journal ArticleDOI
TL;DR: In this paper, a critical review of traditional and emerging cooling methods as well as coolants for electronics is provided, summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed.
Abstract: Continued miniaturization and demand for high-end performance of electronic devices and appliances have led to dramatic increase in their heat flux generation. Consequently, conventional coolants and cooling approaches are increasingly falling short in meeting the ever-increasing cooling needs and challenges of those high heat generating electronic devices. This study provides a critical review of traditional and emerging cooling methods as well as coolants for electronics. In addition to summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed. With superior thermal properties and numerous benefits nanofluids show great promises in fulfilling the cooling demands of high heat generating electronic devices. It is believed that applications of such novel coolants in emerging techniques like micro-channels and micro-heat pipes can revolutionize cooling technologies for electronics in the future.

441 citations

Journal ArticleDOI
TL;DR: In this paper, an experimental study was conducted on the cooling of mobile electronic devices, such as personal digital assistants (PDAs) and wearable computers, using a heat storage unit (HSU) filled with the phase change material (PCM) of n-eicosane inside the device.

313 citations

Journal ArticleDOI
TL;DR: In this article, a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions.

310 citations

Journal ArticleDOI
TL;DR: In this paper, an experimental study was conducted on the cooling of portable hand-held electronic devices using n-eicosane as the phase change material (PCM) placed inside heat sinks with and without internal fins.

266 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849