Showing papers on "Electronics cooling published in 1958"
TL;DR: In this paper, a brief introduction and review is presented of the problems of protecting and cooling airborne electronic equipment in present and future high-speed devices. But the authors focus on the thermal characteristics associated with high speed flight of manned and unmanned vehicles are related to the thermal problems of irreversible electrical and magnetic components.
Abstract: A brief introduction and review is presented of the problems of protecting and cooling airborne electronic equipment in present and future high-speed devices. The thermal characteristics associated with high-speed flight of manned and unmanned vehicles are related to the thermal problems of irreversible electrical and magnetic components which possess upper bounds of temperature for reliable operation. Various types of cooling devices, fluid flow processes, and techniques are presented and discussed, and the trends of future development are reviewed briefly.
2 citations
TL;DR: In this paper, the authors outline the flow of heat within, through, and from heat producing electronic parts in terms of internal thermal limitations, part surface and environmental ratings, and cooling indices.
Abstract: The results of adequate cooling of electronic parts are gains in part life and reliability. An engineering compromise between ideal electronic part temperature and the thermal point of diminishing return must be evaluated not only with respect to desired life, but also in terms of the electronic circuit and cooling efficiencies. This paper outlines the flow of heat within, through, and from heat producing electronic parts in terms of internal thermal limitations, part surface and environmental ratings, and cooling indices. Natural heat flow design data pertinent to conduction cooling of heat sources, tube shields, the placement and mounting of parts, and ?sink connectors? are presented.
1 citations
TL;DR: In this paper, the authors developed equations for cold plates and the effect of variations in fin configuration on performance are discussed. And the application of the cold-plate technique is illustrated for power transistors.
Abstract: A solution to the problem of cooling certain types of high heat-dissipating airborne electronic equipment is the modification of the equipment chassis to incorporate a simple plate-fin heat exchanger, sometimes called a ?cold plate.? In this paper equations for cold plates are developed and the effect of variations in fin configuration on performance are discussed. Theoretical and experimental results based on tubes mounted on a cold plate are found to compare very favorably. The application of the cold-plate technique is illustrated for power transistors. This method of cooling is shown to be useful and efficient.
1 citations
TL;DR: A proposal is offered by which cooling provisions may be standardized for airplanes of widely varying performance, and basic design parameters for the development of such a system are outlined, as are the economic factors involved.
Abstract: High-speed aircraft require the successful operation of large quantities of electronic equipment. The problem of providing a suitable environment for such equipment is of interest to both airplane and electronic designers. A proposal is offered by which cooling provisions may be standardized for airplanes of widely varying performance. Basic design parameters for the development of such a system are outlined, as are the economic factors involved.
1 citations