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Showing papers on "Electronics cooling published in 1981"


Journal ArticleDOI
TL;DR: In this article, a new and novel approach for cooling nuclear instrumentation modules via heat conduction is described, and the simplicity of liquid cooled crates and ease of thermal management with conduction cooled modules are shown.
Abstract: Described is a new and novel approach for cooling nuclear instrumentation modules via heat conduction. We will show the simplicity of liquid cooled crates and ease of thermal management with conduction cooled modules. While this system was developed primarily for the higher power levels expected with Fastbus electronics, it has many general applications.

1 citations


Journal ArticleDOI
TL;DR: A thermocouple/core cooling monitor is described in this article, which provides a nuclear reactor operator with rapidly available, readily understandable data concerning the adequacy of cooling of the reactor core.
Abstract: A Thermocouple/Core Cooling Monitor is described. The system provides a nuclear reactor operator with rapidly available, readily understandable data concerning the adequacy of cooling of the reactor core. The functions of the instrument are briefly described and inadequacies of earlier in-core thermocouple data presentation techniques are reviewed. Descriptions of the thermocouples, the reference junction boxes, and the data processing hardware and software are given. Operational experience to date is summarized.