Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this paper, a three-dimensional numerical analysis was performed on the steady incompressible laminar flow and the conjugate heat transfer in multiple microjet impingement heat sinks.
Abstract: The present study investigates the thermal performance of a silicon-based multiple microjet impingement heat sink for the thermal management of electronics. A three-dimensional numerical analysis was performed on the steady incompressible laminar flow and the conjugate heat transfer in multiple microjet impingement heat sinks. One side of the silicon substrate receives a moderate heat flux of 100 W/cm2; the other side contains the designed jet impingement system. The jet plate consists of many jet holes, so the computational domain was simplified by using symmetric boundary conditions. The effects of the design parameters such as the jet diameter, jet pitch, and standoff (that is, the distance of the nozzle exit to the heated surface) were analyzed under laminar flow conditions. Because of the low pumping power available in the micropumping system, the analysis was carried out at a low Reynolds number. The crossflow effects of the spent flow and the inline jet sweeping were investigated to determine the ...
8 citations
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8 citations
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06 Dec 2013TL;DR: In this paper, the authors present results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios.
Abstract: As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.
8 citations
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TL;DR: In this paper, a small-scale CPL was designed for server in this research The evaporator was designed with a circular groove and embedded with high density polyethylene (HDPE) as a capillary structure to absorb working fluid The influence of reservoir upon thermal resistance was also analyzed.
8 citations