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Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this article, the authors present and experimentally prove a novel concept for embedded, hotspot-targeted and energy efficient cooling of heterogeneous chip power landscapes, which can adapt the heat transfer capability to a steady but non-uniform chip power map by passively throttling the flow in low heat flux areas.
89 citations
TL;DR: In this article, the heat transfer from a discrete heat source to multiple, normally impinging, confined air jets was experimentally investigated, where the jets issued from short, square-edged orifices with still developing velocity profiles on to a foil heat source.
Abstract: Heat transfer from a discrete heat source to multiple, normally impinging, confined air jets was experimentally investigated. The jets issued from short, square-edged orifices with still-developing velocity profiles on to a foil heat source which produced a constant heat flux. The orifice plate and the surface containing the heat source were mounted opposite each other in a parallel-plates arrangement to effect radial outflow of the spent fluid. The local surface temperature was measured in fine increments over the entire heat source. Experiments were conducted for different jet Reynolds numbers (5000ϽRe Ͻ20,000), orifice-to-target spacing ͑0.5ϽH/dϽ4͒, and multiple-orifice arrangements. The results are compared to those previously obtained for single air jets. A reduction in orifice-to-target spacing was found to increase the heat transfer coefficient in multiple jets, with this effect being stronger at the higher Reynolds numbers. With a nine-jet arrangement, the heat transfer to the central jet was higher than for a corresponding single jet. For a four-jet arrangement, however, each jet was found to have stagnation-region heat transfer coefficients that were comparable to the single-jet values. The effectiveness of single and multiple jets in removing heat from a given heat source is compared at a fixed total flow rate. Predictive correlations are proposed for single and multiple jet impingement heat transfer.
88 citations
TL;DR: In this article, an optimization procedure for the design of a Latent Heat Thermal Management System (LHTMS), used for cooling an electronic device with transient and high heat generation, is presented.
85 citations
85 citations
TL;DR: In this paper, the authors investigated the influence of a nanofluid on the thermal characteristics of a specially designed miniature loop heat pipe and explored the mechanism of heat transfer enhancement of the nano-fluid in the mLHP.
84 citations