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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Journal ArticleDOI
TL;DR: In this article, the effect of phase change material (PCM) on the thermal performance of a plate fin heat sink was examined using a different volume fraction of nanoPCM, and the results showed that the heat sink based on PCM enriched with nanoparticles provided better thermal performance compared to the simple PCM.
Abstract: In this study, electronic devices are experimentally examined to improve the thermal performance of the plate fin heat sink. It is performed on the basis of the paraffin wax used as a phase change material (PCM) filled in a heat sink plate. The aim of the study is to select the most efficient SiO2 volume fraction in paraffin wax to be filled in a heat sink with a plate finish. The SiO2 is considered to be a nano-particle and 1%, 3%, and 5% of SiO2 volume is selected for the preparation of nanoPCM. At the base of the plate fin heat sink, a constant heat source is applied. A plate fin heat sink is selected to quantify the effect of nanoPCM as a reference heat sink. The effect of thermal performance of heat sinks was examined using a different volume fraction of nanoPCM. The thermal performance comparison is carried out with and without PCM for the plate heat sink of Reynolds number 4000- 16000. In order to find the effect of PCM and variable Reynolds number, the investigation of the plate fin heat sink is examined. The results showed that the inclusion of PCM (paraffin wax and SiO2-based nanoPCM) in the heat sink plate provides better cooling performance and keeps the desired temperature. The results show that the heat sink based on PCM enriched with nanoparticles provided better thermal performance compared to the heat sink with a simple PCM. The thermal performance of the SiO2 based nanoPCM 3% volume fraction is better than 1% volume fraction and the heat sinks of the plate finish.

7 citations

Journal ArticleDOI
TL;DR: The presented methodology is able to design thermal management structures from a combination of aluminum and copper that perform similar to pure copper but utilizing less expensive materials, resulting in a cost-benefit for electronics manufacturers.
Abstract: In this paper, we apply a level-set (LS) topological optimization (TO) algorithm to the design of multi-material heatsinks suitable for electronics thermal management. This approach is intended to exploit the potential of metal powder additive manufacturing technologies, which enable the fabrication of complex designs. This paper details the state-of-the-art in TO before defining a numerical framework for optimization of two-material and three-material based heatsink designs. The modeling framework is then applied to design a pure copper and a copper–aluminum heatsink for a simplified electronics cooling scenario and the performance of these designs are compared. The benefits and drawbacks of the implemented approach are discussed, along with enhancements that could be integrated within the framework. A benchmarking study is also detailed, which compares the performance of topologically optimized heatsink against a conventional pin-fin heatsink. This is the first time that TO methods have been assessed for multi-material heatsink design where both conduction and convection are included in the analysis. Hence, the reported paper is novel in its application of a state-of-the-art LS topology optimization algorithm to design multi-material structures subject to forced convective cooling. This paper is intended to demonstrate the applicability of TO to the design of multi-material heatsinks fabricated using additive manufacturing processes and succeeds in this objective. This paper also discusses challenges, which need to be addressed in order to progress this modeling as a design approach for practical engineering situations. The presented methodology is able to design thermal management structures from a combination of aluminum and copper that perform similar to pure copper but utilizing less expensive materials, resulting in a cost-benefit for electronics manufacturers.

7 citations

Journal ArticleDOI
TL;DR: The study reveals that the ideal/theoretical limit of heat transfer enhancement obtained with a cascaded fin, with respect to an optimal-profile rectangular fin made in one single material, is about 15%, while for relatively high contact resistances, cascaded fins can remain slightly superior to single material fins.
Abstract: Recent developments in electronics cooling imposed fin structures constructed from two materials (e.g., copper and aluminum) as a thermo-economical solution for heat transfer enhancement. Such fins facilitate savings of expensive materials and reduce operating and investment costs by increasing efficiency. This paper stresses the importance of constraints on the geometrical optimization of “cascaded” fins made from two materials. Two types of constraints are analyzed in a unitary way: fixed weight (relevant to aerospace and transportation applications) and fixed investment cost. The cascaded fin geometry springs from the thermal performance maximization under constraints (constructal principle). To illustrate the design principle and derive its fundamental features, it is sufficient to consider the most basic case of one-dimensional heat conduction through rectangular-rectangular, rectangular-triangular, and rectangular-parabolic cascaded fins. The study reveals that the ideal/theoretical limit of heat tr...

7 citations

Proceedings ArticleDOI
09 Nov 2012
TL;DR: In this paper, the effect of microchannel surfaces on pool boiling performance at atmospheric pressure with FC-87 was investigated and a maximum heat flux of 550 kW/m 2 at a wall superheat of 37°C was obtained with the microchannel surface.
Abstract: Advances in technology and trends towards higher processing speeds have generated a greater need for thermal management. Two-phase cooling (boiling) has the ability to dissipate large amounts of heat and is attractive because of lower mass flow requirement and uniform substrate temperature. Further improvements can be obtained through passive surface enhancements. The objective of this work is to investigate the effect of microchannel surfaces on pool boiling performance at atmospheric pressure with FC-87. Being a dielectric fluid with a low normal boiling point, FC-87 has desirable characteristics for an electronics cooling fluid. A maximum heat flux of 550 kW/m 2 at a wall superheat of 37°C was obtained with the microchannel surface. Surface area increase is noted as the primary reason for the enhanced performance for FC-87 on microchannel surfaces.

7 citations

Proceedings ArticleDOI
27 May 2014
TL;DR: In this paper, the interaction of jets in the vicinity of this location is expected to shed light on improving multi-jet array cooling uniformity and performance, and it has been shown that micro-scale jets tend to behave somewhat differently from larger jets, due to the increased significance of surface tension, pumping noise and edge effects (such as small recirculation zones, and jet widening due to contact-angle at the nozzle exit, noise and nozzle imperfections due to manufacturing).
Abstract: Arrays of impinging jets can cool large areas with good thermal uniformity and are often used in industrial processes, such as drying and electronics cooling. However, due to cross-flow of the spent liquid and interference between adjacent jets, a significant amount of the available cooling performance is lost. Under free-surface jet impingement the area beyond the hydraulic jump is associated with significantly reduced heat transfer, and locally increased temperatures, therefore the hydrodynamics in this area must be better understood. Specifically, the interaction of jets in the vicinity of this location is expected to shed light on improving multi-jet array cooling uniformity and performance. Beyond this, it has been shown that micro-scale (sub-millimeter) jets tend to behave somewhat differently from larger jets, due to the increased significance of surface tension, pumping noise and edge-effects (such as small recirculation zones, and jet widening due to contact-angle at the nozzle exit, noise and nozzle imperfections due to manufacturing). These become much more dominant at the micro-scale. These effects cannot usually be accounted for by traditional scaling laws or numerical simulations, and are preferably investigated experimentally. Moreover, at these scales a micro-machined fixed-geometry array of jets is typically used, leaving no possibility for geometric variation, optimization and limited observation.

7 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849