Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Heat Transfer XI

Abstract: This book contains the edited versions of most of the papers presented at the Eleventh International Conference on Advanced Computational Methods and Experimental Measurements in Heat Transfer and Mass Transfer held in Tallinn, Estonia in 2010. The conference series provides a forum for presentation and discussion of innovative research, new approaches and application of advanced computational methods and experimental measurements to heat and mass transfer problems.Research and development in computational methods for solving and understanding heat transfer problems continue to be important because heat transfer topics are often of a complex nature and more than one mechanism (such as heat conduction, convection, turbulence, thermal radiation and phase change) may occur simultaneously. Typically, applications are found in heat exchangers, gas turbine cooling, turbulent combustion and fires, fuel cells, micro- and minichannels, electronics cooling, melting and solidification etc. In engineering design and development, reliable and accurate computational methods are needed to replace or complement expensive and time-consuming experimental trial and error work. While heat transfer might be regarded as an established and mature scientific discipline, it continues to play a major role in new emerging areas, such as sustainable development and reduction of greenhouse gases, micro- and nano-scale structures, and bio-engineering.

Flow and Thermal Investigation of a Groove-Enhanced Minichannel Application

Abstract: A grooved surface feature is considered as a potential thermal enhancement for electronics cooling with single-phase flow in minichannels. A power electronics module was initially designed using applied computational fluid dynamics (CFD) using a minichannel featuring a series of two-dimensional grooves. To validate these simulations, micro–particle image velocimetry (PIV) was used to examine the flow field at a turbulent Reynolds number of 5000. The velocity distribution was compared directly to CFD simulations of the same geometry. The flow structures matched quantitatively near the groove leading edge and on its windward side, but the flow speeds were significantly underpredicted on the leeward side, deviating by as much as 30% of the freestream speed. This discrepancy was attributable to the selection of the turbulence model in the simulations, which was determined using the micro-PIV results. Using a validated CFD model, simulations predict thermal enhancements on the order of 35%.

Absorption refrigeration method with alternative water-ammonia solution circulation system for microelectronics cooling

Abstract: The study develops an analytical model of an optimized small scale absorption ammonia/water refrigeration system, designed to fit smaller scale power electronics, using a pump to circulate the binary ammonia-water solution cooling agent in the proposed miniaturized system. This continues the authors' previous study [1] of a refrigeration absorption system, by replacing the thermo-siphon and gravitationalbased circulation of the compensatory hydrogen gas with an actual circulation mini-pump, with application to the cooling of the electronic components populating a Printed Circuit Board (PCB) in a High-Power Microelectronics System. It is a viable alternative to the simple absorption system, due to the increase in COP from 0.4 to 0.7, while providing improved feasibility and reliability at smaller scales.

Thermal Management of a Heat-Pipe Drill: A FEM Analysis

Abstract: Thermal management using heat pipes is gaining significant attention in past decades. This is because of the fact that it can be used as an effective heat sink in very intricate and space constrained applications such as in electronics cooling or turbine blade cooling where high heat fluxes are involved. Extensive research has been done in exploring various possible applications for the use of heat pipes as well as understanding and modeling the behavior of heat pipe under those applications. One of the possible applications of heat pipe technology is in machining operations, which involves a very high heat flux being generated during the chip generation process. Present study focuses on the thermal management of using a heat pipe in a drill for a drilling process. To check the feasibility and effectiveness of the heat pipe drill, structural and thermal analyses are performed using Finite Element Analysis. Finite Element Software ANSYS was used for this purpose. It is important for any conceptual design to be made practical and hence a parametric study was carried out to determine the optimum geometry size for the heat pipe for a specific standard drill.Copyright © 2003 by ASME