Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Numerical analysis of a miniature-scale refrigeration system (msrs) for electronics cooling

Abstract: This paper presents the numerical analysis of a Miniature-Scale Refrigeration System (MSRS) for electronics cooling. The system consists of a simulated electronic chip attached to a microchannel cold plate evaporator, a compressor, a microchannel condenser, and an expansion device. The system uses R-134a as the refrigerant. A copper block heater is designed to simulate the heat generation of an electronic chip by using two cartridge heaters of 200 W each. The heat from the simulated CPU is transferred to the cold plate evaporator via a copper heat spreader. The heat spreader is employed to provide uniform heat dissipation from the copper block to the evaporator. In order to analyze the system performance and determine the operating conditions, a numerical simulation of the MSRS was conducted. In addition, the “Fluent”-software was employed to analyze the heat spreader. Experimental results that were obtained using a bread board MSRS were used to validate the model results.

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]

Abstract: We report a simple method to improve bondline formation kinetics by means of a hierarchical set of channels patterned into one of the surfaces. These channel arrays are used to improve the gap squeezing and cooling of single and multiple flip chip electronic modules with highly viscous fluids and thermal pastes. They allow a fast formation of thin gaps or bond lines by reducing the pressure gradient in the thermal interface material as it moves in and out of the gap. Models describing the dynamics of Newtonian fluids in these "hierarchically nested channel" (HNC) interfaces combine squeeze flow and Hagen-Poiseuille theories. Rapid bond line formation is demonstrated for Newtonian fluids and selected particle-filled pastes. Modeling of particle-laden polymeric pastes includes Bingham and Hershel-Bulkley fluid properties. Bond line formation and thermal resistance is improved particularly for high viscosity-high thermal conductivity interface materials created from higher volumetric particle loadings or for thermal interface materials with smaller filler particle diameters.

Loop heat pipe technology for electronics cooling

Abstract: Loop heat pipes (LHPs) are passive heat transport devices with the capillary-driven circulation of the two-phase working fluid. LHPs currently used mainly in Aerospace applications due to their relatively high fabrication cost. LHPs outperform conventional heat pipes in terms of the maximum heat transport capability, operation in any orientation in the gravity field, and heat transport length. It can be advantageous to use loop heat pipes for transporting, spreading, and dissipating heat in modern electronics, where the heat dissipation per unit volume is rapidly increasing This paper describes some LHP design features and experimental results obtained for two low-cost LHPs.

Radiative Cooling of Satellite-Borne Electronic Components

Abstract: The basic principles of radiative cooling of electronic components and subassemblies in a satellite are discussed, and estimates are made of the lowest temperatures attainable in a satellite by completely passive means. It appears feasible to maintain some compartments within a satellite at temperatures of 250°K or lower, so an opportunity is presented for refrigerating components whose characteristics are enhanced at lower temperatures.

Effect of Material Inhomogeneity on Thermal Performance of a Rheocast Aluminum Heatsink for Electronics Cooling

Abstract: The relation between microstructural inhomogeneity and thermal conductivity of a rheocast componentmanufactured from two different aluminum alloys was investigated. The formation of two different p ...