Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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27 May 1998
TL;DR: In this article, the performance of miniature heatpipe developed for the cooling of electronic equipment and on evaluation of the notebook computer cooling systems in which they are used were reported. But, the results indicate that the miniature heat-pipe can be applied to electronic equipment cooling, and evaluation tests of the cooling system using this miniature heat pipe have clarified the effectiveness of the miniaturized heatpipe.
Abstract: This paper reports on the performance of miniature heat-pipes developed for the cooling of electronic equipment and on evaluation of the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipes were conducted on their thermal properties and reliability. The results indicate that the miniature heat-pipe can be applied to electronic equipment cooling, and evaluation tests of the cooling system using this miniature heat-pipe have clarified the effectiveness of the miniature heat-pipe.
5 citations
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14 Dec 2016TL;DR: In this paper, the authors analyzed the variation of the liquid layer thickness in the trapezoidal micro channels and the thermal flow change over time, and the modification of liquid flow was studied in correlation with the capacity of polysynthetic material to retain the most extra fluid in its pores.
Abstract: Up to now, there have been developed various applications of thermal micro pipes [1-3] , such as refrigerating systems, high heat flux electronics cooling, and biological devices etc., based on vacuum vaporization followed by a convective phenomenon that allows vapor transfer from the vaporization area to the condensation one. This article presents studies carried out on the enhancement of the convective phenomenon taking place in flat thermal micro pipes. The proposed method [4] is aimed at the cooling of power electronics components, such as microprocessors. The conducted research focused on the use of shape memory materials that allow, by a semi-active method, to bring extra fluid in the vaporization area of the thermal micro pipe. The conducted investigations analyzed the variation of the liquid layer thickness in the trapezoidal micro channels and the thermal flow change over time. The modification of liquid flow was studied in correlation with the capacity of the polysynthetic material to retain the most extra fluid in its pores. The enhancement of the convective heat transfer phenomenon in flat thermal micro pipes was investigated in correspondence to the increase of liquid quantity in the vaporization zone. The charts obtained by aid of Mathcad [5] allowed to represent the evolution during a period of time (or with the pipe’s length) of the liquid film thickness, the flow and the thermal flow, as a function of the liquid supply variation due to the shape memory materials and the modification of the working temperature.
5 citations
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17 Oct 2000TL;DR: In this paper, a heat exchange system for a vehicle having one of an internal combustion engine (1) and an electric motor with associated power semiconductors (2) was presented.
Abstract: The presented invention relates to a heat exchange system for a vehicle having one of an internal combustion engine (1) and an electric motor with associated power semiconductors (11) existing hybrid motor, the engine cooling circuit (9) with a mechanical water pump (3) and the electronics cooling circuit (10) is provided an electric water pump (12). The two cooling circuits (9, 10) are openable by optionally by valves or closable connection lines (l The invention is a Grundheizfunktion for the passenger compartment during standstill phases of the internal combustion engine (1) is ensured (Figure 1).
5 citations
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05 Jan 2004TL;DR: In this paper, a pitch-based carbon foam liquid cooler was proposed to enhance the heat transfer due to the thermal dispersion effect, which has an effective conductivity up to 150 W/m-K and porosity up to 90%.
Abstract: Abstract : A liquid cooler module (LCM) employing a high thermal-conductivity, pitch-based carbon foam is studied. The newly developed carbon foam has an effective conductivity up to 150 W/m-K and porosity up to 90%. It is believed that this high-conductivity carbon foam could significantly enhance the heat transfer due to the thermal dispersion effect. To prove the concept of the carbon foam liquid cooler, a three-dimensional numerical study of the carbon foam cooler was undertaken. The numerical results indicated that even with a heat flux as high as 100 W/cm2, the average temperature drop between the substrate and the liquid coolant is less than 20 degrees C. Experimental study was also undertaken for the LCM and the results were compared with the numerical results.
5 citations
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26 Oct 2005TL;DR: An electronics cooling fan comprises at least one collapsible fan blade driven by centrifugal force to extend radially as the fan spins and driven by elastic force to retract as spinning slows or stops as mentioned in this paper.
Abstract: An electronics cooling fan comprises at least one collapsible fan blade driven by centrifugal force to extend radially as the fan spins and driven by elastic force to retract as spinning slows or stops.
5 citations