Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Basic study on flow and heat transfer performance of pulsating air flow for application to electronics cooling

Abstract: Our study tries to apply a pulsating airflow to one of a heat transfer enhancement method in electronic equipment. In recent electronic equipment, a lot of electrical components are mounted while their performance increases and a level of heat dissipation becomes higher. The components cause flow separation of the cooling air and heat transfer performance rear the components generally decreases. Therefore the mounting position of the heating components is restricted in order to avoid the separated flow region. In order to improve the heat transfer rear the components, we are now focusing on the flow pulsation. By generating the flow pulsation of the airflow, the development of the separated flow region rear the components may be inhibited and the heat transfer performance rear the components may be improved. In addition, the flow pulsation can be generated by controlling the input power of the cooling fan easily. From these backgrounds, we tried to investigate flow and heat transfer characteristics of the pulsation flow around the components. In this report, we developed the experimental system in order to evaluate flow and heat transfer performance of the pulsation flow around the electrical components experimentally. By using the experimental system, we tried to evaluate the cooling performance of the pulsation flow around cylindrical blocks, which simulates electrical components. Through the experiment, we evaluated the effectiveness of the pulsation flow as the cooling method of electronic equipment.

Passive cooling of small telecommunication enclosures. Case study and practical approach

Abstract: The dynamic progress in development of telecommunication equipment along with harsh environment of its applications, are driving increasing demand for optimal thermal management of the outdoor enclosures. There are number of methods currently utilized to remove waste heat from the enclosure. They represent active means such as air conditioning or thermoelectric cooling, semi-active such as air-to-air heat exchanger or passive such as convection cooling. Due to reliability and service issues, the trend is toward a fully passive method with minimum moving parts. The use of the phase change material (PCM) method represents such an approach. The PCM method uses the phenomena of waste heat absorption via thermal capacity of the phase change process. The paper discusses the application of PCM for cooling of an enclosure with variety of electronic equipment (battery vault, distributed power equipment, telecommunication, etc.). The challenges associated with the heat removal in such applications are presented followed by the PCM technique application proposal and system design methodology. The simulation, laboratory and field test data are presented for the specific application (including battery vault and small enclosures with telecommunication equipment). Finally, the comments on applicability of Bellcore specifications followed by application range and method limitations are discussed.

Validating a Reduced-Order Model for Synthetic Jet Actuators Using CFD and Experimental Data

Abstract: Synthetic jet actuators (SJA) are emerging in various engineering applications, from flow separation and noise control in aviation to thermal management of electronics. A SJA oscillates a flexible membrane inside a cavity connected to a nozzle producing vortices. A complex interaction between the cavity pressure field and the driving electronics can make it difficult to predict performance. A reduced-order model (ROM) has been developed to predict the performance of SJAs. This paper applies this model to a canonical configuration with applications in flow control and electronics cooling, consisting of a single SJA with a rectangular orifice, emanating perpendicular to the surface. The practical implementation of the ROM to estimate the relationship between cavity pressure and jet velocity, jet velocity and diaphragm deflection and applied driving voltage is explained in detail. Unsteady Reynolds-averaged Navier Stokes computational fluid dynamics (CFD) simulations are used to assess the reliability of the reduced-order model. The CFD model itself has been validated with experimental measurements. The effect of orifice aspect ratio on the ROM parameters has been discussed. Findings indicate that the ROM is capable of predicting the SJA performance for a wide range of operating conditions (in terms of frequency and amplitude).

Design and analysis of liquid cooling plates for different flow channel configurations

Abstract: A number of thermal management devices are used to actuate concentrated electronic appliances in an efficient way. A liquid cooling plate acts as a heat sink enclosed by materialized walls. This work aims to carry out design of liquid cooling plates such that the heat diffused by the electronic equipment is removed while their temperatures levels remain within safe limits. The liquid cooling plates expose “cold surfaces” to electronic appliances. The performance of a cooling plate is estimated depending upon heat carrying capacity, associated heat transfer rates and concentrated thermal regions on the plate surface. For this study, the design of liquid cooling plate was done with SOLIDWORKS. Pure water was used as a working fluid in test channels. A comparative analysis of flow distribution, temperature contours, pressure drop and pumping power for different channel configurations was carried out with ANSYS. It was observed that a channel configuration is of key importance in liquid cooling plates. The findings from this study are beneficial for the optimum design of cooling systems for high heat flux applications, i.e., in electronic devices, computer processors and automotive engines.