Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices—Thermal Design and Manufacturing Considerations

Abstract: Electronics cooling research has been largely focused on high heat flux removal from computer chips in the recent years. However, the equally important field of high-power electronic devices has been experiencing a major paradigm shift from air cooling to liquid cooling over the last decade. For example, multiple 250-W insulated-gate bipolar transistors used in a power drive for a 7000-HP motor used in pumping or in locomotive traction devices would not be sufficiently cooled with air-cooling techniques. Another example is a “hockey puck” SCR of 63 mm diameter used to drive an electric motor that could dissipate over 1500 W and is difficult to cool with air because of the shape of the device. Other devices include radio-frequency generators, industrial battery chargers, printing press thermal and humidity control equipment, traction devices, mining devices, crude oil extraction equipment, magnetic resonance imaging, and railroad engines. This article classifies the cold plates into four types: formed tube...

Water and Forced-Air Cooling of Vacuum Tubes Nonelectronic Problems in Electronic Tubes

Abstract: General laws of heat transfer from a hot wall to a moving fluid are applied to water and forced-air cooling of vacuum tubes. The calculated data are compared with experimental results. The practical importance of various factors constituting the mechanism of heat transfer is analyzed; the role of the internal structure of the tube on the dissipation limits is discussed generally. Rules for designing finned air coolers are outlined, and the "optimum" design is discussed. Numerical examples are given. Some limiting factors in cooler design are analyzed.

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

Abstract: We present a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. The focus is on CLTPTs for electronics cooling that exhibit complex two-phase flow patterns due to the closed loop geometry and small tube size. The present model is based on mass, momentum, and energy balances in the evaporator, rising tube, condenser, and the falling tube. The homogeneous two-phase flow model is used to evaluate the friction pressure drop of the two-phase flow imposed by the available gravitational head through the loop. The saturation temperature dictates both the heat source (chip) temperature and the condenser heat rejection capacity. Thermodynamic constraints are applied to model the saturation temperature, which also depends upon the local heat transfer coefficient and the two-phase flow patterns inside the condenser. The boiling characteristics of the enhanced structure are used to predict the chip temperature. The model is compared with experimental data for dielectric working fluid PF-5060

Methods and apparatuses for electronics cooling

Abstract: Methods and apparatuses for cooling a device are disclosed The device may be an electrical or electronic component that includes an integrated circuit or embedded control The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger At least two configurations are disclosed: one with a pump and another without a pump