Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
Papers published on a yearly basis
Papers
More filters
01 Jan 2009
TL;DR: In this article, a honeycomb porous micro channel cooling system for cooling of electronic chips is proposed, which can effectively remove the heat flux of 18.2W/cm2 under 2.4W pumping power while the junction-wall temperature is 48.3°C at the room temperature of 26°C.
Abstract: A honeycomb porous micro channel cooling system for cooling of electronic chips is proposed in this paper. The design, fabrication, test system configuration of the micro channel heat sink is summarized. Preliminary experimental investigation is conducted to determine the heat transfer characteristics and cooling performance under steady single-phase flow of water liquid. In the experiments, the brass micro channel heat sink is attached to a test heater with 8cm2 area, the experimental results show that the cooling system can effectively remove the heat flux of 18.2W/cm2 under 2.4W pumping power, while the junction-wall temperature is 48.3°C at the room temperature of 26°C. The experimental results show that the present cooling system has good performance.Copyright © 2009 by ASME
5 citations
TL;DR: In this article, laser etching manufacturing technique is employed to develop metal surfaces with designed microstructured surface patterns, such precise control of the solid-air interface (artificial roughness) allows to manufacture metal heat sinks with enhanced thermal transmittance with respect to traditional flat surfaces.
Abstract: The efficient dissipation of localized heat flux by convection is a key request in several engineering applications, especially electronic ones. The recent advancements in manufacturing processes are unlocking the design and industrialization of heat exchangers with unprecedented geometric characteristics and, thus, performance. In this work, laser etching manufacturing technique is employed to develop metal surfaces with designed microstructured surface patterns. Such precise control of the solid-air interface (artificial roughness) allows to manufacture metal heat sinks with enhanced thermal transmittance with respect to traditional flat surfaces. Here, the thermal performance of these laser-etched devices is experimentally assessed by means of a wind tunnel in a fully turbulent regime. At the highest Reynolds number tested in the experiments ( R e L ≈ 16 , 500 ), elliptic scale-roughened surfaces show thermal transmittances improved by up to 81% with respect to heat sinks with flat surface. At similar testing conditions, cones patterns provide an enhancement in Nusselt number and thermal transmittance of up to 102% and 357%, respectively. The latter results are correlated with the main geometric and thermal fluid dynamics descriptors of the convective heat transfer process in order to achieve a predictive model of their performance. The experimental evidence shown in this work may encourage and guide a broader use of micro-patterned surfaces for enhancing convective heat transfer in heat exchangers.
5 citations
16 Jul 2012
TL;DR: In this article, the authors proposed a sensitivity analysis of a linear compressor for electronics cooling and showed that for optimum performance, the leakage gap and eccentricity should be minimized and the ratio of p iston stroke to diameter should not exceed a value of one to min imize friction and leakage losses.
Abstract: A comprehensive model of a linear compressor for electronics cooling was previously presented by Brads haw et al. (2011). The current study expands upon this work by first developing methods for predicting the resona nt frequency of a linear compressor and for controlling its pist on stroke. Key parameters governing compressor performance ‐ leakage gap, eccentricity, and piston geometry ‐ ar e explored using a sensitivity analysis. It is demo nstrated that for optimum performance, the leakage gap and eccentricity should be minimized. In addition, the ratio of p iston stroke to diameter should not exceed a value of one to min imize friction and leakage losses, but should be la rge enough to preclude the need for an oversized motor.
5 citations
TL;DR: In this article, the authors extended previous work in stacked Nb/AlO/sub x/ devices to investigate the nonequilibrium effects in them and examine the influence of barrier conductance and layer thickness on the electronic cooling achievable by this technique.
Abstract: Several recent papers have predicted the feasibility of superconducting tunnel junction-based electronic cryocooler devices operating in the temperature range 0.1-4 K. We have extended previous work in stacked Nb/AlO/sub x/ devices to investigate the nonequilibrium effects in them and to examine the influence of barrier conductance and layer thickness on the electronic cooling achievable by this technique. We have also analysed the maximum cooling possible with junctions of our present conductance.
5 citations
01 Jan 2020
TL;DR: In this article, the authors present an updated description of the general simulation software presented at ITHERM 2017, which is able to analyze and design thermosyphon-based cooling systems with high accuracy.
Abstract: Two-phase micro-scale cooling implemented with passive, gravity-driven closed-loop thermosyphons represents a highly-reliable solution to increase heat dissipation and to maximize energy efficiency of the next-generation electronics cooling technologies. The current paper presents an updated description of the general simulation software presented at ITHERM 2017, which is able to analyze and design thermosyphon-based cooling systems with high accuracy. In particular, the present simulator is mainly composed of two nested sub-routines: (i) an internal routine that incorporates the best literature methods to evaluate local flow boiling and local condensation heat transfer coefficients and pressure drops in micro-scale evaporator cold plates (at the heat source location) and condensers (at the heat rejection location); and (ii) an external routine that includes the methods to simulate all components of a thermosyphon (condenser, riser, downcomer, evaporator and, optionally, liquid accumulator) with their operational characteristics and thermal performance. In addition, a new extensive experimental validation of the thermosyphon code is performed, in which the simulation results are compared against a comprehensive thermosyphon database, including several types of micro-scale evaporators, different types of condensers (air-cooled and liquid-cooled), various riser/downcomer diameters, a range of thermosyphon heights and numerous refrigerants as working fluids. In fact, the thermosyphon simulator has been validated over a wide range of thermosyphon sizes, going from the smallest height of 15 cm for server cooling applications up to the largest height of 50 cm to cool high-power telecommunications electronics. Finally, the paper discusses the effects of different parameters on the thermosyphon thermal-hydraulic performance, such as working fluid, riser/downcomer diameters, secondary side coolant inlet temperature and mass flow rates, filling ratio and heat load in order to give guidelines and recommendations for an accurate and robust system design.
5 citations