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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Journal ArticleDOI
TL;DR: In this article, the authors describe another type of notch filter, called the short stub filter (SSF), which is quite insensitive to imperfections in cables and components, and can therefore be constructed from commercially available components.
Abstract: The shorted stub filter (SSF) has been used extensively to provide the electronics gain shaping for stochastic cooling of longitudinal beam emittance. The repetitive notch of this filter results from the cancellation of the incident signal by the reflected signal at frequencies where the cable electrical length equals an integer number of half wavelengths. Variations in notch depth of the SSF have been approximately compensated by a rather complicated system. Dispersion of the notch frequency resulting from variation of the phase velocity can also be approximately corrected using tuned imperfections in the shorted cable. Dispersion due to imperfections in the coaxial cable can be quite significant and can only be compensated for by costly construction techniques. This paper describes another type of notch filter. Although this filter has been mentioned previously, this analysis demonstrates the advantages of this filter in providing small notch dispersion and other properties necessary for stochastic cooling systems. Because this filter uses only forward signals, it is quite insensitive to imperfections in cables and components, and can therefore be constructed from commercially available components.

5 citations

Proceedings ArticleDOI
01 Jan 2004
TL;DR: In this paper, the authors investigated the effects of various parameters on the performance of a piezoelectric fan in terms of heat transfer and forced convection induced by an oscillating fan in an enclosure.
Abstract: Piezoelectric fans have emerged as a viable alternative for electronics cooling applications requiring low input power and noiseless operation. A piezoelectric fan is a cantilever actuated by a piezoelectric ceramic material bonded to it. The fan oscillates back and forth creating airflow when an alternating electric field is applied to this bonded piezoelectric ceramic. Forced convection induced by such an oscillating fan in an enclosure is numerically investigated. The computational model is capable of sustaining deforming fluid cells that allow large boundary movement. The moving wall boundary, modeled as large-amplitude beam deflection, initiates flow in the fluid domain which enhances convection to varying extents depending on the heat source-to-fan distance and beam deflection amplitude. The effects of these parameters on heat transfer are studied. Transition between distinct convection patterns is observed with changes in the parameters. Results are validated against experimental measurements, with good agreement.Copyright © 2004 by ASME

5 citations

Journal ArticleDOI
TL;DR: This study demonstrates, for the first time, the effectiveness of combining a VAT-based nonlocal thermal-fluid-solid model with population-based optimization methods, such as PSO, to design heat sinks for electronics cooling applications.
Abstract: Cooling electronic chips to satisfy the ever-increasing heat transfer demands of the electronics industry is a perpetual challenge. One approach to addressing this is through improving the heat rejection ability of air-cooled heat sinks, and nonlocal thermal-fluid-solid modeling based on volume averaging theory (VAT) has allowed for significant strides in this effort. A number of optimization methods for heat sink designers who model heat sinks with VAT can be envisioned due to VAT's singular ability to rapidly provide solutions, when compared to computational fluid dynamics (CFD) approaches. The particle swarm optimization (PSO) method appears to be an attractive multiparameter heat transfer device optimization tool; however, it has received very little attention in this field compared to its older population-based optimizer cousin, the genetic algorithm (GA). The PSO method is employed here to optimize smooth and scale-roughened straight-fin heat sinks modeled with VAT by minimizing heat sink thermal resistance for a specified pumping power. A new numerical design tool incorporates the PSO method with a VAT-based heat sink solver. Optimal designs are obtained with this new tool for both types of heat sinks, the performances of the heat sink types are compared, the performance of the PSO method is discussed with reference to the GA method, and it is observed that this new method yields optimal designs much quicker than traditional approaches. This study demonstrates, for the first time, the effectiveness of combining a VAT-based nonlocal thermal-fluid-solid model with population-based optimization methods, such as PSO, to design heat sinks for electronics cooling applications. The VAT-based nonlocal modeling method provides heat sink design capabilities, in terms of solution speed and model rigor, that existing modeling methods do not match. © 2014 by ASME.

5 citations

Book
02 Jul 2014
TL;DR: The proceedings of the thirteenth edition of the Simulation and Experiments in Heat and Mass Transfer (SETA) series as discussed by the authors have been published, which is devoted to the simulation and experiments in heat transfer and its applications.
Abstract: "Heat Transfer XIII: Simulation and Experiments in Heat and Mass Transfer" contains the proceedings of the thirteenth conference in the well established series on Simulation and Experiments in Heat Transfer and its applications. Advances in computational methods for solving and understanding heat transfer problems continue to be important because heat transfer topics and related phenomena are commonly of a complex nature and different mechanisms like heat conduction, convection, turbulence, thermal radiation and phase change as well as chemical reactions may occur simultaneously. Typically, applications are found in heat exchangers, gas turbine cooling, turbulent combustion and fires, fuel cells, batteries, micro- and mini- channels, electronics cooling, melting and solidification, chemical processing etc. Heat Transfer might be regarded as an established and mature scientific discipline, but it has played a major role in new emerging areas such as sustainable development and reduction of greenhouse gases as well as for micro- and nano- scale structures and bioengineering. Non-linear phenomena other than momentum transfer may occur due to temperature-dependent thermophysical properties. In engineering design and development, reliable and accurate computational methods are requested to replace or complement expensive and time consuming experimental trial an error work. Tremendous advancements have been achieved during recent years due to improved numerical solution methods for non-linear partial differential equations, turbulence modelling advancements and developments of computers and computing algorithms to achieve efficient and rapid simulations. Nevertheless, to further progress in computational methods requires developments in theoretical and predictive procedures - both basic and innovative - and in applied research. Accurate experimental investigations are needed to validate the numerical calculations. Topics covered include: Heat transfer in energy producing devices; Heat transfer enhancements; Heat exchangers; Natural and forced convection and radiation; Multiphase flow heat transfer; Modelling and experiments; Heat recovery; Heat and mass transfer problems; Environmental heat transfer; Experimental and measuring technologies; Thermal convert studies.

5 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849