Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Performance analysis of air-cooled microchannel absorber in absorptionbased miniature electronics cooling system

Abstract: Theoretical analysis and simulation of performance of an air-cooled microchannel absorber is reported in this study It is shown that the air-cooled microchannel absorber can be integrated into an absorption-based miniature electronics cooling system by which the chip junction temperature can be maintained near room temperature, while removing 100 W of heat load Water/LiBr pair is used as the working fluid and refrigerant vapor is intended to counter-currently flow against aqueous LiBr solution flow Parametric study is carried out to determine the effects of several operating parameters, including inlet temperature and mass flow rate of the coolant, and inlet temperature of LiBr solution To facilitate the air-cooling of microchannel absorber, an offset-strip-fin array is adopted, by which enhanced air-side heat transfer coefficient and large heat transfer area are obtained The performance of the air-cooled absorber is compared to liquid-cooled absorber

Design and evaluation of heat transfer fluids for direct immersion cooling of electronic systems

Abstract: Comprehensive molecular design was used to identify new heat transfer fluids for direct immersion phase change cooling of electronic systems. Four group contribution methods for thermophysical properties relevant to heat transfer were critically evaluated and new group contributions were regressed for organosilicon compounds. 52 new heat transfer fluids were identified via computer-aided molecular design and figure of merit analysis. Among these 52 fluids, 9 fluids were selected for experimental evaluation and their thermophysical properties were experimentally measured to validate the group contribution estimates. Two of the 9 fluids (C6H11F3 and C5H6F6O) were synthesized in this work. Pool boiling experiments showed that the new fluids identified in this work have superior heat transfer properties than existing coolant HFE 7200. The radiative forcing and global warming potential of new fluids, calculated via a new group contribution method developed in this work and FT-IR analysis, were found to be significantly lower than those of current coolants. The approach of increasing the thermal conductivity of heat transfer fluids by dispersing nanoparticles was also investigated. A model for the thermal conductivity of nanoparticle dispersions (nanofluids) was developed that incorporates the effect of size on the intrinsic thermal conductivity of nanoparticles. The model was successfully applied to a variety of nanoparticle-fluid systems. Rheological properties of nanofluids were also investigated and it was concluded that the addition of nanoparticles to heat transfer fluids may not be beneficial for electronics cooling due to significantly larger increase in viscosity relative to increase in thermal conductivity.

An investigation of magnet parameters on the performance of dual piezoelectric fans (DPF) in electronics cooling system

Abstract: Recently, piezoelectric fan has gained attention as potential active cooling method for electronics devices. Even though the piezoelectric requires high voltage, there are findings to overcome the shortcomings. Adding on a magnet at the tip of the piezoelectric fan to activate other magnetic passive fans is one of the methods to increase the total amplitude generated by the fans. This paper will discuss on the performance of integrated piezoelectric fan with passive fans (later refer to magnetic fans) to enhance the heat transfer in cooling system. A repulsive force produced by the magnets will cause the magnetic blades to oscillate together with the piezoelectric fan. The paper will focus on the optimization parameters of the magnets for selected dimension of piezoelectric fan. The parameters under investigation are the position of the magnet on the piezoelectric fan, number of magnets on each blades and orientation of blades with respect to adjacent blade. Results show that the magnet at middle location of extensive blade with double magnets generate the largest amplitude, 80% better than fan without magnet and for dual integrated piezoelectric fan with magnetic fan, radial orientation gives better result by 25%. By increasing the total amplitude, it shows a good agreement for positive heat transfer improvement compared to natural convection.

Convective Cooling Evaluation of Electronic Devices using Lock-in Thermography

Abstract: This paper presents the basis of dynamic thermography, with its application to thermal parameters evaluation. The method is based on windowed FFT analysis, with special attention paid for the phasegrams interpretation. A thermal modeling of the investigated object based on lumped RC network has been made to estimate the sensitivity and accuracy of the method. Heat transfer coefficient, thermal conductivity of the material, and thickness of multilayer structure are the major parameters that can be evaluated. The proposed approach can be used mainly for electronic applications.