Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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27 Jun 2005TL;DR: In this paper, a numerical simulation based on CFD for air impingement heat transfer is conducted in the case of axisymmetric impinging jet by adopting various turbulence models and wall functions.
Abstract: Air impingement cooling, as a potential air-cooling technique, has been shown to be much efficient and enabled to complement conventional forced convective air-cooling in electronics To provide reliable references to the computational thermal analyses based on CFD for effective air-cooling technique integrated in microsystem electronics packaging, the numerical simulation based on CFD for air impingement heat transfer is conducted in the case of axisymmetric impinging jet by adopting various turbulence models and wall functions The results indicate that the inherent disadvantage of the overpredictions of the turbulent kinetic energy and heat transfer rate in the stagnation region for the standard and realizable k-epsiv turbulence models primarily depends on the improper modeling of the source term in the transport equation of the turbulent energy dissipation rate, rather than the isotropic eddy viscosity assumption and high pressure gradient in the vicinity of the stagnation point The RNG k-epsiv turbulence model greatly improves the prediction accuracy of the turbulent viscosity and heat transfer rate in the stagnation region and seems to be preferable not only to the standard and realizable k-epsiv turbulence models but also to advanced Reynolds stress turbulence model to some extent in respect to the prediction capability with respect to the turbulence and heat transfer characteristics for such an axisymmetric impinging jet
4 citations
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TL;DR: In this paper , the authors developed a figure of merit (FOM) that characterizes the efficacy of evaporative heat transfer from microstructured surfaces, which can serve as a tool to survey available structures and also optimize their dimensions for heat and mass transfer enhancement.
4 citations
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07 Aug 2002
TL;DR: In this paper, a hybrid approach to model extruded heat sinks was studied using Icepak, a computational fluid dynamics (CFD) software for electronics cooling applications, which resulted in savings in CPU requirements by a factor of approximately 4 to 5.
Abstract: Shell conduction plates (thin conducting plates) are computational fluid dynamics (CFD) objects that may be used to model three-dimensional conduction in thin, plate-like objects used in electronic cooling applications. The use of zero thickness conducting plates for fins of extruded heat sinks can result in significant reduction in mesh elements when compared to an equivalent case using thick fins. Shell conduction plates model three dimensional conduction in a solid as well as viscous stresses at a fin surface accurately. However, they do not account for the flow impedance caused by the thickness of the actual plates. Therefore, volumetric resistances with appropriate flow loss coefficients derived from existing channel flow correlations were used to account for the flow blockage caused by the fins. The validity of using such a hybrid approach to model extruded heat sinks was studied using Icepak, a CFD software for electronics cooling applications. Results suggest that the present approach can be used to reduce the cost of computational analysis while maintaining accuracy. The above approach resulted in savings in CPU requirements by a factor of approximately 4 to 5. For the cases considered, the grid sizes were reduced by approximately 60%.
4 citations
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14 Sep 2020
TL;DR: In this paper, a linear air flow amplifier designed to replace rotary fans for various industries where their performance is undesirable like electronics cooling applications in compact data center servers is investigated, which operates with no moving parts and generates a high-speed uniform flow attached to the rack server surface with a need for a detailed investigation into the mechanism of fluid flow, heat transfer and noise generation associated with its operation.
Abstract: This paper investigates the potential of a novel linear air flow amplifier designed to replace rotary fans for various industries where their performance is undesirable like electronics cooling applications in compact data center servers. The device operates with no moving parts and generates a high-speed uniform flow attached to the rack server surface with a need for a detailed investigation into the mechanism of fluid flow, heat transfer, and noise generation associated with its operation. To progress the state of the art, a high aspect ratio rectangular air amplifier is developed and characterized from various engineering aspects to address the flow performance, energy efficiency and acoustic performance of the new devices in a side by side comparison versus high-speed axial fans. As the preliminary effort in the development of the novel air amplifier, this paper aims to investigate the hydrodynamic characteristics of the air amplifier using analytical and experimental methods.
4 citations
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15 Mar 2009TL;DR: In this article, laser machined microchannels are shown to be a feasible method for fabricating more complex microchannel designs and tree-branch or fractal-like micro-channels were shown to provide considerable reduction in pressure drop for a given flow rate compared to traditional straight micro channels.
Abstract: For applications where space restrictions limit the feasibility of heat spreading in high-powered electronic devices, integrated direct cooling is a viable but underexplored method for keeping critical devices cool. Direct integrated cooling by putting microchannels of varying designs into common device substrate materials (e.g., SiC) is examined. Laser machined microchannels are shown to be a feasible method for fabricating microchannels into materials where etching is not. The flexibility of laser machining to fabricate more complex microchannel designs is assessed and tree-branch or “fractal-like” microchannels are shown to provide considerable reduction in pressure drop for a given flow rate compared to traditional straight microchannels.
4 citations