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Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In 1988, volume 9, issue 3 was published, containing nine papers in all: two papers rep... as discussed by the authors, which was the first issue devoted to the subject of electronics cooling.
Abstract: It has been over fifteen years since this journal had an issue devoted to the subject of electronics cooling. In 1988, volume 9, issue 3 was published, containing nine papers in all: two papers rep...
4 citations
01 Jan 2010
TL;DR: In this article, a one dimensional dynamic system model is developed to accurately simulate a two-phase microchannel electronics cooling loop, which is based on the single component mixture equations for mass, momentum and energy.
Abstract: A one dimensional dynamic system model is developed to accurately simulate a two-phase microchannel electronics cooling loop This model is based on the single component mixture equations for mass, momentum and energy These equations are solved numerically using a finite volume method in conjunction with the SIMPLE algorithm To calculate the pressure losses and heat transfer state of the art empirical correlations are used Furthermore size effects of a typical microchannel cooling system are investigated with the new model Special attention is given to the accumulator size and its limitations for portable applications A simple model to investigate the accumulator size effect on the loop is developed and compared to numerical results obtained from the system model The influence of various loop parameters and possible improvements are also investigated Finally the effect of using different coolants is studiedCopyright © 2010 by ASME
4 citations
01 Jun 2004
TL;DR: In this article, an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm/sup 2, employing latent heat of vaporization of dielectric fluids.
Abstract: This paper describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm/sup 2/, employing latent heat of vaporization of dielectric fluids. Micro-spray nozzles are fabricated to produce 50-100 micron droplets coupled with surface texturing on the backside of the chip to promote spreading and boiling. A novel features to enable adaptive on-demand cooling is MEMS sensing and MEMS actuation. EDIFICE is integrated within the electronics package and fabricated using advanced micromanfacturing technologies.
4 citations
02 Jun 2010
TL;DR: In this article, a thermal management system is considered that incorporates a TEC system for active cooling in parallel with a conventional passive system, and a thermal resistance network model is developed for that hybrid system that takes into account the governing equations for the TEC.
Abstract: Conventional cooling techniques, such as the use of heat pipes and forced convective cooling can be inadequate for many high performance electronic chips or when the operating ambient temperature is high. In such cases, there is a need for active cooling of the chip to keep its operating temperature below the design point. Thermoelectric coolers (TEC) provide an attractive option in such instances, and have been developed and used for thermal management in electronic packaging systems. In this paper a hybrid thermal management system is considered that incorporates a TEC system for active cooling in parallel with a conventional passive system. A thermal resistance network model is developed for that hybrid system that takes into account the governing equations for the TEC. The advantage of the hybrid system is that it can be operated with a higher overall system coefficient of performance for partial loads, while extending the range of operating conditions. System performance curves are obtained for change in heat load from the chip and ambient temperature.
4 citations
Patent•
27 Sep 2005TL;DR: A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the lower and upper surfaces, moving from the central area out to the periphery.
Abstract: A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the lower and upper surfaces, moving from the central area out to the periphery. This allows the heat flux lines to be more evenly spaced and regular in length, as compared to a typical plate with flat upper and lower surfaces of equal surface area.
4 citations