Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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TL;DR: In this paper, a novel experimental study of convective heat transfer in serpentine microchannels with segmented liquid-liquid emulsions is presented, and it is demonstrated that this concept yields significant Nusselt number enhancement in microchannel heat sinks compared to that obtained using single phase liquid cooling.
74 citations
TL;DR: In this paper, a new dynamic simulation tool using interconnected PDEs is described in the first part of the present paper followed by the validation of the modeling for both steady and dynamic regimes using a first-of-a-kind 15 cm-height thermosyphon test bench.
74 citations
05 Jul 2006
TL;DR: In this article, a small-scale refrigeration system for the cooling of high power components in notebook form factors is described, which includes a compressor, cold plate, condenser, and throttling device.
Abstract: The cooling of high power components in notebook computers is uniquely challenging due to space constraints that limit the size of the thermal solution. As a result, for some applications, a method of inserting a "negative" thermal resistance into the heat flow path may be required in order to achieve higher component powers. In this paper we describe a small-scale refrigeration system for the cooling of high power components in notebook form factors. The small-scale refrigeration system includes a compressor, cold plate, condenser, and throttling device. These components are designed for a vapor-compression cycle with iso-butane as the working fluid. All of these components are designed such that the entire system can be incorporated within a notebook form factor. In order to achieve the targeted performance, the cold plate and condenser contain microchannels to efficiently transfer heat to and from the refrigerant. Prototypes of each of the components were built and tested in order to assess their individual performance. A complete form factor loop was also built and tested in order to determine overall system feasibility and performance. The test results show that the targeted performance of the system (COP > 2.25) is achievable in this form factor at the moderate temperature rise expected in this application
73 citations
TL;DR: In this article, the thermal performance of a copper-water flat heat pipe composed of a novel wick structure with an inner thickness for working fluid less than 1 mm has been investigated.
73 citations
TL;DR: In this paper, an experimental study on exergetically efficient electronics cooling using hot water as coolant was conducted and it was shown that water temperatures as high as 60°C are sufficient to cool microprocessors with over 90% first law (energy based) efficiency.
71 citations