scispace - formally typeset
Search or ask a question
Topic

Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
More filters
Proceedings ArticleDOI
01 Oct 2015
TL;DR: In this article, the authors proposed that the service life of air conditioning systems can be considerably reduced by applying energy-efficient free cooling systems to the cooling setup, which can cover 16-93% of the total cooling demand depending on the location of the base stations.
Abstract: The number of telecommunication base stations is increasing all over the world due to an ever increasing communication demand. As a result, energy savings play an important role in our future and sustainable network architecture. In a typical base station, electronics cooling normally accounts for 25–50% of the total energy consumption, traditionally provided by air conditioning systems. The service life of air conditioning systems can be considerably reduced by applying energy-efficient free cooling systems to the cooling setup. For an indoor temperature set point of 25 °C, free cooling can cover 16–93% of the total cooling demand depending on the location of the base stations. When adjusting to a higher indoor temperature set point, the savings will increase accordingly.

3 citations

DissertationDOI
01 Jan 2009
TL;DR: In this paper, a system level model, criteria of selecting working fluids, and individual component models for modularized design of LHP condenser and evaporator were developed, and new figures of merit for measuring capillary limit and heat leak effects are defined, the condensation pressure drop is always dominating the loop pressure drop in air-cooled LHPs, and a published LHP prototype for laptop computer cooling is simulated.
Abstract: LHPs are promising two-phase thermal transport devices for electronics cooling. The developed modeling tools include a system level model, criteria of selecting working fluids, and individual component models for modularized design of LHP condenser and evaporator. Based on these tools, new figures of merit for measuring capillary limit and heat leak effects are defined, the condensation pressure drop is shown to be always dominating the loop pressure drop in air-cooled LHPs, and a published LHP prototype for laptop computer cooling is simulated. The modeling results agree well with the available experimental data and reveal that the air flow is the bottleneck of this prototype.

3 citations

Book ChapterDOI
01 Jan 1994
TL;DR: In this paper, a double Fourier series technique is used to develop an analytical expression for the three-dimensional temperature field within a thin multiple layer substrate cooled by convection and heated by sources mounted on one side.
Abstract: A double Fourier series technique is used to develop an analytical expression for the three-dimensional temperature field within a thin multiple layer substrate cooled by convection and heated by sources mounted on one side. The temperature distribution, in a dimensionless form, is a function of nondimensional parameters: the Biot number, aspect ratios and conductivity ratios of each layer, and the ratios of Fourier coefficients which describe the sources. A parametric study is presented to illustrate the influences of these parameters for a practical electronics cooling problem. Equivalent series and parallel orthotropic conductivity components are derived which can be used to model multiple layer structures as single layers.

3 citations

Book ChapterDOI
01 Jan 2015

3 citations

Journal ArticleDOI
01 Feb 1954
TL;DR: In this article, a general survey is made of the temperature dependence of noise and electrical resistance down to the region of absolute zero, and it is shown that the signal-to-noise ratio in a metallic resistor can be increased by lowering its temperature, while cooling has little effect on carbon resistors.
Abstract: Considering potential practical applications of low-temperature phenomena, a general survey is made of the temperature dependence of noise and electrical resistance down to the region of Absolute Zero. It is shown that the signal-to-noise ratio in a metallic resistor can be increased by lowering its temperature, while cooling has little effect on carbon resistors. The theory of electrical conductance in metals is reviewed, and it is determined that whenever ohmic losses are important as in an inductance, decreasing the temperature can be a help. The phenomenon of superconductivity is treated, including use of the superconducting properties of certain metals in the construction of a very sensitive bolometer and in the frictionless suspension of a lead sphere.

3 citations


Network Information
Related Topics (5)
Heat transfer
181.7K papers, 2.9M citations
83% related
Thermal conductivity
72.4K papers, 1.4M citations
78% related
Thermal conduction
60.6K papers, 1.1M citations
73% related
Laminar flow
56K papers, 1.2M citations
72% related
Wafer
118K papers, 1.1M citations
72% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849