Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Compressor assembly having electronics cooling system

Abstract: A refrigeration system having a compressor, a condenser, an evaporator, an accumulator, and electronics for controlling the compressor. The accumulator collects gaseous and liquid refrigerant passing from the evaporator to the compressor. The electronics are mounted to the accumulator to transfer heat from the electronics to the refrigerant located within the accumulator to cool the electronics.

Cooling performance of triangular folded fin heat sinks in a duct flow

Abstract: Experiments have been performed to investigate the cooling performance of triangular folded-fin heat sinks made of aluminum in a duct flow. The dimension of the triangular folded fin heat sink is 70 mm in width and 92 mm in length with a 10 mm thick base plate. The fin height is varied from 19 mm to 36 mm and the fin pitch from 4 mm to 8 mm. The duct air velocity is in the range of 0.7/spl sim/5 m/s and the corresponding Reynolds number based on the hydraulic diameter is varied from 159 to 2280. The cooling performance of triangular folded fin heat sink is expressed in terms of the averaged Nusselt number and thermal resistance. The experimental results show that the present triangular folded-fin heat sinks exhibit higher cooling performance compared to a conventional extruded plate-fin heat sink with the same fin height. The cooling performance of triangular folded-fin heat sink is significantly influenced by the fin height, the fin pitch and the Reynolds number. By compiling the experimental data, a heat transfer correlation is provided for effective design of triangular folded fin heat sinks.

High thermal conductivity materials and their application on the electronic products

Abstract: We can find a variety of high thermal conductivity of polymer materials, polymer, oxide materials, nitrides materials, carbon family material, metal material, iron-based materials, high thermal conductivity graphite and so on, the best choice for material in a variety of electronic products on the chip cooling is high thermal conductivity graphite. In this work, high thermal conductivity graphite film was used for chip cooling in the smart phone, and we found that it can lower their operating temperature. In the case of 4G LTE will be widely used with high speed rate and high bandwidth, the consumer electronics cooling problem is particularly prominent.

Enhancement of confined air jet impingement heat transfer using perforated pin-fin heat sinks

Abstract: The development of semiconductor fabrication process and electronic packaging technology causes the size and weight of electronic components to decrease consistently. Along with the increasing operating power, the heat generation rate of the electronic products apparently get higher. Efficient removal of heat from the electronic products in a limited space becomes a major task in electronics cooling. Air impingement cooling with a heat sink is an attractive option for electronic cooling, because it is inexpensive, robust and localized. Rapid heat transfer from heated surfaces and reducing material weight is also becoming a major task for design of heat exchanger equipment for electronic cooling. Rectangular plate fins as extended surfaces are good heat transfer equipment which are widely used for various industrial applications. Heat transfer rate can be improved by introducing perforations, porosity or slots. Moreover, due to restrictions in setup space and economic reasons, heat transfer equipment have been required to be much more compact in size and lighter in weight. Studies on three dimensional plate and pin fin heat sinks are extensive. But no focus has been yet given on air jet impingement heat transfer with perforated pin fin heat sink. Thermal-fluid characteristics of solid and perforated pin fin heat sinks cooled by confined air jet impingement are investigated numerically in this study. The SST k-ω turbulence model is used to predict the turbulence flow parameters. The numerical model is verified with previously published experimental data. Flow and heat transfer characteristics are presented for the impinging Reynolds number, Re= 5000 to 25000 having constant impingement distance (Y/D = 8), fin width (W/L = 0.1) and height (H/L =0.5). The main objective of this study is to examine the effects of fin perforations on the thermal performance of pin fin heat sinks. Results show that thermal resistance decreases and fin efficiency increases with the increase of Reynolds number due to perforation. Thus, this kind of heat sink equipment reduce cooling power consumption rate.