Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

High performance heat sink for electronics cooling

Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on another surface, at least two fins and porous reticulated foam blocks having intervening gaps that fill the width and at least a portion of the length between the fins. The foam block may be a continuous single block within the space between two adjacent fins along the length of the fins or may be an array of short-length blocks having intervening gaps along the length of the fins.

Optimal design of miniature piezoelectric fans for cooling light emitting diodes

Abstract: Piezoelectric fans have emerged as a viable cooling technology for the thermal management of electronic devices with their low power consumption, minimal noise emission, and small and configurable dimensions. In this work, these fans are investigated for application in the cooling of electronics components and light emitting diodes (LEDs). Different experimental configurations are considered, and the effect of varying the fan amplitude, the distance between the fan and the heat source, the fan length, its frequency offset from resonance, and the fan offset from the center of the heat source are studied to assess the cooling potential of piezoelectric fans. A design-of-experiments (DOE) analysis revealed the fan frequency offset from resonance and the fan amplitude as the critical parameters. Transfer functions are obtained from the DOE analysis for the implementation of these fans in electronics cooling. For the best case, an enhancement in convective heat transfer coefficient exceeding 375% relative to natural convection was observed, resulting in a temperature drop at the heat source of more than 36.4/spl deg/C.

Ethylene glycol (EG)-based nanofluids as a coolant for automotive radiator

Abstract: In this paper, the cooling capabilities of an ethylene glycol (EG)-based nanofluid containing three different types of nanoparticles: copper oxide (CuO), aluminium oxide (Al2O3), and titanium dioxide (TiO2) are investigated. Nanofluids have enhanced thermophysical properties, hence they can be used in a plethora mechanical and engineering applications such as nanofluid coolant: electronics cooling, vehicle cooling, transformer cooling, computers cooling and electronic devices cooling. A model depicting the vertical fluid flow in a radiator is formulated. Using appropriate similarity transformation and shooting quadrature coupled with Runge–Kutta–Fehlberg integration scheme, the model boundary value problem is tackled numerically. A parametric study of the entire flow regime is carried out to illustrate the effects of the pertinent parameters on the velocity, temperature, skin friction coefficient and the local Nusselt number. It is clear that CuO–EG nanofluids lead to a rapid decrease of temperature at the boundary layer.

High Heat Flux Two-Phase Cooling in Silicon Multimicrochannels

Abstract: This paper presents performances of two-phase cooling of a chip at very high heat flux with refrigerant R236fa in a silicon multimicrochannel heat sink. This heat sink was composed of 134 parallel channels, 67 mum wide, 680 mum high, and 20 mm long, with 92- mum -thick fins separating the channels. The base heat flux was varied from 3 to 255 W/cm2 , the volume flow rate from 0.18 to 0.67 I/min, and the exit vapor quality from 0 to 80%. The working pressure and saturation temperature were set at 273 kPa and 25 degC, respectively. The present database includes 1040 local heat transfer coefficients. The base temperature of the chip could be maintained below 52 degC while dissipating 255 W/cm2 with 10 degC of inlet subcooling and 90 kPa of pressure drop. A comparison of the respective performances with an extrapolation of the present results shows that two-phase cooling should be able to cool the chip 13 K lower than liquid cooling for the same pumping power at a base heat flux of 350 W/cm2.

Gas-assisted evaporative cooling of high density electronic modules

Abstract: Reliable operation of advanced microelectronic components in three-dimensional packaging configurations necessitates the development of cooling systems capable of removing high heat fluxes and very high heat densities. A recently patented thermal management technique, using high velocity flow of a liquid-gas mixture in the narrow channels between populated substrates, appears to provide such a thermal transport capability. A prototype, high packaging density module, relying on this approach, has been successfully operated and a research study, focusing on the heat transfer rates attainable with this technique in a single, asymmetrically-heated channel has been completed. This paper begins with a description of this gas-assisted evaporative cooling approach, its advantages in thermal packaging of microelectronics, and its implementation in a prototype high-performance computer module. Attention is then paid to theoretical considerations in the flow of gas-liquid-vapor mixtures in narrow parallel plate channels and to the design and operation of an appropriate experimental apparatus. Next, experimental results for the wall temperature, heat transfer coefficients, and pressure drops are presented and compared to theoretical predictions. The paper concludes with a discussion of the thermal packaging potential of this novel thermal management technique. >