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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Proceedings ArticleDOI
04 Nov 1997
TL;DR: In this paper, the authors consider the problem of finding the optimal thickness and number of fin-connections for a given heatsink size for a particular operating condition, such as approach velocity, array velocity, pressure drop, air pumping power or a particular fan curve.
Abstract: Forced air cooling of high density electronics has begun to reach space and weight limits beyond the performance capabilities of standard extrusions. Though extrusions are improving, other manufacturing techniques such as machining, bonded fin, investment casting, folded fin and semi-solid forging provide higher fin densities. When a particular operating condition, such as approach velocity, array velocity, pressure drop, air pumping power or a particular fan curve is fixed, there is an optimum thickness and number of fins for a given heatsink size. In many cases, the optimum design for a heatsink requires a fin density which can only be produced by one of the alternative methods.

2 citations

18 Mar 2019
TL;DR: In this article, an ultra-thin loop heat pipe is proposed for small electronic devices, which has a one-way heat transport length of 200mm and a heat transport capability above 10 W. The TLHP showed stable operation at different power cycles with a heat load of 5-10 W.
Abstract: In this paper, an ultra-thin loop heat pipe is proposed for small electronic devices. The thin LHP (TLHP) was designed, fabricated, and tested to meet the heat dissipation requirements of small or thin electronic devices. The proposed LHP with an evaporator thickness of 1.0 mm has a one-way heat transport length of 200mm, and a heat transport capability above 10 W. The test results showed that the TLHP could be transferred up to 12 W and maximum temperature of the heater is about 90°C. The TLHP showed stable operation at different power cycles with a heat load of 5-10 W. Hysteresis is not confirmed after three cycles of the heat load.

2 citations

Patent
30 Jul 2013
TL;DR: In this article, a heat pipe system and methods of arranging a heatpipe system are provided. But they do not consider the problem of placing a plurality of heat pipes on a rotatable body.
Abstract: A heat pipe system and methods of arranging a heat pipe system are provided. The heat pipe system includes a plurality of heat pipes, with each of the plurality of heat pipes including a hot end thermally coupled to a heat source and a cold end thermally coupled to a heat sink The plurality of heat pipes include a first pair of heat pipes. When the plurality of heat pipes are secured to a rotatable body, the first pair of heat pipes are aligned with and oriented in opposing directions along a first axis of rotation of the rotatable body.

2 citations

Proceedings ArticleDOI
01 Jun 2004
TL;DR: In this paper, the fluid flow and heat transfer characteristics of liquid cooled foam heat sinks (FHSs) are investigated, and the thermal resistances of the FHSs are plotted against the pressure drop and the pump power, together with a microchannel heat sink.
Abstract: In this paper, the fluid flow and heat transfer characteristics of liquid cooled foam heat sinks (FHSs) are investigated. Open-celled copper foam materials with two pore densities of 60 and 100 PPI (pore per inch) and four porosities varying from 0.6 to 0.9 were bonded onto copper base plates to form the FHSs. The FHSs were then assembled on flip chip BGA packages (FBGA) with thermal grease as the thermal interface material. A liquid cooling test loop was established to study the flow and heat transfer characteristics. Both pressure drops and thermal resistances were obtained through experiments. For the four 60 PPI FHSs, the one with the lowest porosity of 0.6 is found to possess the lowest thermal resistance level with the largest pressure drop. The FHSs with 100 PPI generally have slightly lower thermal resistances at the same flowrates but much larger pressure drops than the FHSs with 60 PPI. For overall performance assessment, the thermal resistances of the FHSs are plotted against the pressure drop and the pump power, together with a microchannel heat sink. At the given pressure drop and pump power, the thermal resistance of the FHS with a porosity of 0.8 and pore density of 60 PPI is the lowest among all the FHSs and is comparable to that of the microchannel heat sink. This study reveals that FHSs are a promising option in high performance electronics cooling.

2 citations

Proceedings ArticleDOI
01 Jun 2004
TL;DR: In this paper, the authors examined the effect of tightly enclosing a thermal heat sink in order to learn about arrangements and enclosure limits that strangle the ability of the heat sink to perform sufficiently.
Abstract: Heat sinks play a very important role in cooling of microelectronic devices. In particular, active heat sinks have been employed extensively to cool integrated circuit electronic devices and especially high power logic processors. An active heat sink has a miniature tubeaxial fan on to the top of a low profile heat sink. With its own fan, the active heat sink does not have to rely on the power supply fan for cooling the device. The performance of these devices has been documented both in journals and patents. In most computer systems, there is a considerable issue with adequate space for active heat sinks to perform optimally. Recently, Markell examined the effect of tightly enclosing a thermal heat sink in order to learn about arrangements and enclosure limits that strangle the ability of the heat sink to perform sufficiently. This examination was carried out experimentally by calculating the thermal resistance of a heat sink when placed in a variety of enclosures. In this paper, a "Numerical Investigation of Enclosure Effects on Spot Cooling Devices" is described. The model is a quarter model of a single channel with a fan. The mass flow rate in the outlet region of the fin and the flow exit region is displayed. Based on the findings, air flow blocking means was provided in order to redirect the flow and insure that appropriate air flow is provided to hot spot regions.

2 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849