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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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01 Jan 2014
TL;DR: In this article, a planar cooling device with three key innovations in the evaporator, wick, and reservoir layer was proposed, which provided enhanced cooling performance without wick dryout and back flows.
Abstract: The three-dimensional thermal ground plane was developed in response to the needs of high-power density electronics applications in which heat must be removed as close to the chip surface as possible. The novel design for this planar cooling device was proposed with three key innovations in the evaporator, wick, and reservoir layer, which provided enhanced and reliable cooling performance without wick dryout and back flows. For the evaporator and reservoir layer, a combination of a tapered channel and a triple-spike microstructure was designed to break up the pinned meniscus at the end of the vapor and liquid channels. The overall microstructure had three spikes where the main liquid meniscus was separated by a middle spike and then continued to flow between the tapered walls of the middle and side spikes. For the wick layer, a nanowire-integrated microporous silicon membrane was developed to overcome dryout by driving the coolant out of the channels and spreading the coolant on top of the wick surface with the assistance of extended capillary action. This innovative design used nanowires to extend and enhance capillary force, especially at the end of the pores where the coolant was pinned and unable to overflow out of the pores. The chronic dryout problem in micro cooling devices could be solved by these innovative designs. To analyze the thermal-fluid system, fluid dynamic and phase-change models were used to calculate thermodynamic and fluidic properties, such as operating temperature, pressure, vapor-liquid interface radius of curvature, and rate of bubble formation. The microscale heat conduction theory derived from traditional Fourier's law with classical size effect and effective medium theory were used to calculate the thermal conductivities of nanowires and porous silicon wick in the cross-plane direction, respectively. The theoretical results of porous silicon showed good agreement with the experimental results measured by the 3u technique, demonstrating the reduction of thermal conductivity from bulk silicon. Cooling performance of the developed device was demonstrated experimentally with a micro ceramic heater, thermocouple modules, and microfabrication techniques, including photoelectrochemical etching to create porous silicon, deep reactive-ion etching to form a thin wick membrane, and hydrothermal synthesis to grow nanowires on top of the wick membrane. This study shows the feasibility of reliable, continuous, and high-performance micro cooling devices using enhanced capillary forces to address the increasing requirements of thermal management for chip-level electronics.

2 citations

Proceedings ArticleDOI
01 Nov 2016
TL;DR: In this paper, the authors investigated the possibility of an improvement of cooling performance on the surface of heating elements by using an intermittent jet flow like a geyser in nature, which is widely used for electronics cooling such as CPU coolers and advanced mini-channel devices.
Abstract: This study describes a possibility of an improvement of cooling performance on the surface of heating elements by using an intermittent jet flow like a geyser in nature. An impinging jet flow is widely used for electronics cooling such as CPU coolers and advanced mini-channel devices because the high heat transfer performance can be generally obtained. Due to a miniaturization of electronic equipment, an improvement of cooling performance of cooling devices is strongly needed in order to eject higher heat flux while miniaturizing the dimensions of the cooling devices. We focus on an intermitted jet flow like a geyser in nature. In this study, we investigated the possibility of the heat transfer enhancement on heating surface, which simulates the surface on the cooling channel or the electrical chips, by using the intermittent impinging jet. By controlling the supply flow rate of the jet periodically, the development of the boundary layer on the cooling surface may be inhibited and the net heat transfer performance may be improved. The cooling performance of the intermittent impinging jet on the surface was evaluated experimentally while changing the pattern of the time variation of the supply flow rate. Through the experiment, we clarified the possibility of improving the cooling performance of the impinging jet by controlling the flow rate intermittently.

2 citations

Proceedings ArticleDOI
29 Aug 2017
TL;DR: In this article, a double-ended cylinder with a volume of 150 cm(3) is evaluated as the liquid accumulator for two different system volumes (associated to two different condensers).
Abstract: Gravity-driven two-phase liquid cooling systems using flow boiling within micro-scale evaporators are becoming a game changing solution for electronics cooling. The optimization of the system's filling ratio can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm(3) is evaluated as the liquid accumulator for two different system volumes (associated to two different condensers). Results demonstrated that the liquid accumulator provided robust thermal performance as a function of filling ratio for the entire range of heat loads tested. In addition, the present liquid accumulator was more effective for a small volume system, 599 cm(3), than for a large volume system, 1169 cm(3), in which the relative size of the liquid accumulator increased from 12.8 % to 25% of the total system's volume.

2 citations

Proceedings ArticleDOI
Feng Zhou1, Yan Liu1, Shailesh N. Joshi1, Yanghe Liu1, Ercan M. Dede1 
06 Jul 2015
TL;DR: In this paper, a manifold microchannel heat sink with high modularity and performance for electronics cooling, utilizing two well established (i.e., jet impingement and channel flow) cooling technologies, is presented.
Abstract: The present work is generally related to the design of a manifold microchannel heat sink with high modularity and performance for electronics cooling, utilizing two well established (i.e., jet impingement and channel flow) cooling technologies. The present cold plate design provides flexibility to assemble manifold sections in five different configurations to reach different flow structures, and thus different cooling performance, without redesign. The details of the modular manifold and possible configurations of a cold plate comprising three manifold sections are shown herein. A conjugate flow and heat transfer 3-D model is developed for each configuration of the cold plate to demonstrate the merits of each modular design. Parallel flow configurations are used to satisfy a uniform cooling requirement from each module, but a “U-shape” parallel flow “base” configuration cools the modules more uniformly than a “Z-shape” flow pattern due to intrinsic pressure distribution characteristics. A serial fluid flow configuration requires the minimum coolant flow rate with a gradually increasing device temperature along the flow direction. Two mixed (i.e., parallel + serial flow) configurations achieve either cooling performance similar to the “U-shape” configuration with slightly more than half of the coolant flow rate, or cooling of a specific module to a much lower temperature level. Generally speaking, the current cold plate design significantly extends its application to different situations with different cooling requirements.Copyright © 2015 by ASME

2 citations

Proceedings ArticleDOI
01 May 2016
TL;DR: In this paper, a conformal encapsulation of the devices and direct contact liquid cooling is introduced to address size, weight and power constraints of onboard application with a CFD-enabled design that delivers a uniform coolant flow over single and multi-device layouts through a microgap channel.
Abstract: A new technology for onboard liquid cooling of high power density electronic devices is introduced via conformal encapsulation of the devices and direct contact liquid cooling. This research effort addresses size, weight and power constraints of onboard application with a CFD-enabled design that delivers a uniform coolant flow over single- and multi-device layouts through a microgap channel. The paradigm shift is the replacement of inefficient remote air cooling and associated high resistance conduction paths with the use of microgap flow boiling with direct coolant contact at the device level. The coolant used in all measurements is Novec™ 7200, and the electronics are emulated with resistance heaters on a 1∶1 scale. Thermal performance is demonstrated at power densities on the order of 1 KW/cm3. Parameters investigated include average device temperature, pressure drop, flow field characterization, and overall heat transfer coefficients. For single chip encapsulation, thermal-fluid performance with microgaps of 0.25, 0.5 and 0.75 mm is determined. With low coolant inlet subcooling, two-phase heat transfer is seen at all coolant mass flows. Device temperatures reach 95 °C for power dissipation of 50 – 80 W depending on coolant flow for a gap of 0.5 mm. Inlet subcooling of 25 and 51 °C permits higher power dissipation with nucleate flow boiling on the device surface. For multi-device encapsulation comprising two memory chips arranged symmetrically in line with a larger processor, the best thermal performance is obtained for inlet flow over the processor. For all measurements, the gap between the processor and encapsulation is 0.5 mm, and the gap above the memory chips is 1.0 mm. For inlet coolant flow first over the memory chips, the small chips exceed the 95°C limit when processor power is ∼50 W or less. Processor temperature reaches 95 °C at ∼80 W over the range of coolant flows tested. For inlet flow first over the processor, memory device temperatures are approximately the same over all levels of processor and memory chip powers. For processor power 40 W, two-phase heat transfer dominates, and a processor power of 120 W is reached within the 95 °C threshold.

2 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849