Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

A system comparison between water and air-borne cooling systems for telephone exchanges

Abstract: The authors compare three cooling systems (two airborne and one waterborne) for telephone exchanges: (1) cooling through a false floor; (2) conventional air conditioning; and (2) cooling with natural convection coils, for instance using the Ericsson cooling system ERICOOL. The waterborne natural-convection system appears to be the most advantageous. The system has the following advantages: lowest power consumption; easiest achievement of cooling reserve in case of main failure; best working environment in the switching room; greatest development potential for future electronic packaging structures with increased power densities. >

Air-Conditioning in Telecom Installations with Lowest Energy Consumption

Abstract: The air-conditioning of telecommunication centers is generally characterized by an all year high cooling load and by low outside air requirements. Therefore a chance would exist for the inexpensive so-called "free cooling" by use of colder outside air during most of the operating time throughout the year, if the expenditure for the then necessary humidification would not soon exceed the saved-up expenditure for cooling. This paper describes a new technical and operational concept to overcome this disadvantage of "free cooling", which allows savings of operating costs for air-conditioning up to 75%.

Chill Out: Freezing Attacks on Capacitors and DC/DC Converters

Abstract: This paper introduces a non-invasive, low-cost, and trace-free capacitor freezing attack on DC/DC converters, which uses off-the-shelf electronics cooling sprays to rapidly decrease the capacitors’ temperature. Due to the temperature drop, the converters are unable to maintain their specified output voltages, and their transient behavior changes. When the attack has finished, the temperature of the capacitors quickly returns to normal, while any evidence of the attack vanishes.

Fundamental study on heat transfer characteristics of microencapsulated phase change material suspensions flowing in circular mini-pipe

Abstract: Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined in this paper. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3 µm was supplied into the mini-pipe having a diameter of 1 mm. The mass concentration of MEPCM was changed from 0 to 5 %. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.