Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Effect due to a series of heat sinks on component temperatures

Abstract: It is common practice to employ a small heat sink for hot components in order to maintain the appropriate component temperature. Extensive studies of heat sink performance have been made either experimentally or numerically. However, most of those investigations are limited to the case with a single component alone on a printed circuit board (PCB). In practical applications, the condition with a single component on the board never exists. The temperature of a given component is always affected by surrounding components. In some cases, several hot components may be placed next to each other, and each individual component may also require a heat sink to achieve a desired temperature. The effects of nearby components, with or without heat sinks, on each other over a PCB has never been examined. The purpose of this study is use of 3D CFD code to investigate the thermal performance of a series of heat sinks on a group of components which are placed together on a printed circuit board.

Flow Boiling of HFE-7100 in Multi-Microchannels: Effect of Surface Material

Abstract: The effect of surface material on the flow boiling characteristics in a multi-microchannel evaporator is described in this paper. HFE-7100, a dielectric and eco-friendly working fluid, was tested at atmospheric pressure, inlet sub-cooling of 5 K, base heat flux up to 433.5 kW/m and mass flux range 50–250 kg/ms. Two heat sinks made of copper and aluminium were fabricated having the same channel dimensions giving a hydraulic diameter of 0.46 mm with a base area of 500 mm. The average roughness was measured and the values were 0.286 μm and 0.192 μm for the copper and aluminium, respectively. The effect of surface material was not significant at low heat flux. However, it became significant at moderate and high wall heat fluxes. The flow patterns for the two microchannels were similar and included bubble, slug, churn and annular flow. The experimental results showed that the aluminium surface achieved on the average difference of 12% higher heat transfer coefficients than those found in the copper microchannel. It also gave higher flow boiling pressure drop; the average difference was up-to approximately 30%. The different surface microstructures in the two examined heat sinks could explain the different heat transfer and pressure drop behaviour.