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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Journal ArticleDOI
TL;DR: In this paper, the authors outline the flow of heat within, through, and from heat producing electronic parts in terms of internal thermal limitations, part surface and environmental ratings, and cooling indices.
Abstract: The results of adequate cooling of electronic parts are gains in part life and reliability. An engineering compromise between ideal electronic part temperature and the thermal point of diminishing return must be evaluated not only with respect to desired life, but also in terms of the electronic circuit and cooling efficiencies. This paper outlines the flow of heat within, through, and from heat producing electronic parts in terms of internal thermal limitations, part surface and environmental ratings, and cooling indices. Natural heat flow design data pertinent to conduction cooling of heat sources, tube shields, the placement and mounting of parts, and ?sink connectors? are presented.

1 citations

Journal ArticleDOI
01 Dec 2020
TL;DR: In this article, heat transfer and fluid flow characteristics from rib roughened rectangular duct with different shapes of ribs were investigated and it was observed that boot shaped rib is having higher thermal performance than other two geometries.
Abstract: There are number of applications such as gas turbines, solar air heating, electronics cooling and heat exchangers, where internal cooling passage is observed. For heat transfer augmentation inside these cooling passages different techniques are used like dimpled surface, wings and ribs. Ribs are used in most of the devices for internal cooling. The ribs disturb the boundary layer and increase the turbulent kinetic energy which enhances the heat transfer rate. Most of the researchers concentrate on square and rectangular shaped ribs. The cross section of the rib plays important role in the production of flow field. The shape of ribs affects on boundary layer separation, attachment and hot spots created. In the present paper heat transfer and fluid flow characteristics from rib roughened rectangular duct with different shapes of ribs were investigated. The experimental set up consists of rectangular channel of aspect ratio 4. The pitch to width ratio was varied as 5, 7.5 and 10 respectively. The Reynolds number was varied as 6000 to 30000. The ribs used for the investigations were square, house and boot shaped. From the investigations it is observed that boot shaped rib is having higher thermal performance than other two geometries

1 citations

Journal ArticleDOI
TL;DR: In this paper , the influence of employing nanofluids for cooling a chip was investigated experimentally in order to evaluate the heat transfer characteristics of the micro-channel heat sink.
Abstract: Energy is one of the primary foundations supporting evolutionary changes. Heat transfer is improved by increasing the surface area density and/or changing the base fluid characteristics. Because of its small size and improved heat transfer properties, nanofluid cooled microchannel heat sinks (MCHS) have lately become a popular choice for electronics and thermal applications. The influence of employing nanofluids for cooling a chip was investigated experimentally in this work to evaluate the heat transfer characteristics. The investigations were carried out in order to confirm the influence of nanofluid concentration and wall temperature upon thermal-hydraulic properties of the microchannel heat sink. In present study, Al2O3 water nanofluid was employed, with 0.1, 0.2, 0.3, 0.4, and 0.5% nanoparticle volume fractions, mass flow rate (MFL) 2, 5, and 8 m/s at 25, 30 and 35oC inlet tempreture. The resulting experimental findings was verified from results obtained by other researchers, which showed important correlation. The heat transfer efficacy of electronics cooling systems has been enhanced by the nanofluid technology and the configuration of the rectangular heat sink.

1 citations

Proceedings ArticleDOI
09 Nov 2018
TL;DR: In this article, an experimental study was carried out to evaluate thermal performance of high porosity (95%) and high pore density (90 PPI) copper foam in buoyancy induced flow conditions and compared with a baseline smooth surface.
Abstract: Porous media like open celled metal foams inherently provide a high heat transfer area per unit volume due to their interconnected cellular structure and are lightweight. High pore density metal foam because of its small overall dimensions and micro feature size shows promise in thermal packaging of compact electronics. An experimental study was carried out to evaluate thermal performance of high porosity (95%) and high pore density (90 PPI) copper foam of size 20 mm × 20 mm × 3 mm in buoyancy induced flow conditions and compared with a baseline smooth surface. The enhanced surface showed about 15% enhancement in average heat transfer coefficient over the baseline case. To optimize the performance further, the foam sample was cut into strips of 20 mm × 5 mm × 3 mm and attached symmetrically on the central 20 mm2 base surface area with inter-spacing of 2.5 mm. This new configuration led to further 15% enhancement in heat transfer even with 25% lesser heat transfer area. This is significant as heat transfer is seen as a strong function of permeability to flow through the structure over heat conduction through it. To test this hypothesis, a third configuration was tested in which the strips were further cut into blocks of 4 mm × 4 mm × 3 mm and attached in a 3 × 3 array on to the base surface. Here, only 36% of the central 20 mm2 base surface area was covered with foam. The heat transfer performance was found to be within ± 10% of the initial metal foam configuration, thereby, supporting the hypothesis. Performance was seen to decrease with increase in inclination from 0° to 30° to 90° with respect to the vertical.

1 citations

Posted Content
TL;DR: In this article, the authors used the finite volume CFD software FLUENT to analyze the performance of one fan at a given flow rate (1.5m3/min) for three different operational rotating speeds (2,000, 2,350 and 2,700 rpm).
Abstract: Using the finite volume CFD software FLUENT, one fan was studied at a given flow rate (1.5m3/min) for three different operational rotating speeds : 2,000, 2,350 and 2,700 rpm. The turbulent air flow analysis predicts the acoustic behavior of the fan. The best fan operating window, i.e. the one giving the best ratio between noise emissions and cooling performance, can then be determined. The broadband noise acoustic model is used. As the computation is steady state, a simple Multiple Reference Frame model (MRF, also known as stationary rotor approach) is used to represent the fan. This approach is able to capture the effects of the flow non-uniformity at the fan inlet together with their impact on the fan performance. Furthermore, it is not requiring a fan curve as an input to the model. When compared to the available catalog data the simulation results show promising qualitative agreement that may be used for fan design and selection purposes.

1 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849