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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Journal Article
TL;DR: Ganatra et al. as mentioned in this paper explored the feasibility of a passive cooling system based on phase change materials (PCMs) for thermal management of mobile devices, which stabilizes temperatures due to the latent heat of phase change thus increasing the operating time of the device before threshold temperatures are exceeded.
Abstract: Ganatra,Yash Yogesh M.S.M.E, Purdue University, December 2016. Passive Thermal Management using Phase Change Materials. Major Professor: Amy Marconnet, School of Mechanical Engineering. The trend of enhanced functionality and reducing thickness of mobile devices has led to a rapid increase in power density and a potential thermal bottleneck since thermal limits of components remain unchanged. Active cooling mechanisms are not feasible due to size, weight and cost constraints. This work explores the feasibility of a passive cooling system based on Phase Change Materials (PCMs) for thermal management of mobile devices. PCMs stabilize temperatures due to the latent heat of phase change thus increasing the operating time of the device before threshold temperatures are exceeded. The primary contribution of this work is the identification of key parameters which influence the design of a PCM based thermal management system from both the experiments and the numerical models. This work first identifies strategies for integrating PCMs in an electronic device. A detailed review of past research, including experimental techniques and computational models, yields key material properties and metrics to evaluate the performance of PCMs. Subsequently, a miniaturized version of a conventional thermal conductivity measurement technique is developed to characterize thermal resistance of PCMs. Further, latent heat and transition temperatures are also characterized for a wide range of PCMs. In-situ measurements with PCMs placed on the processor indicate that some PCMs can extend the operating time of the device by as much as a factor of 2.48 relative to baseline tests (with no PCMs). This increase in operating time is investigated by computational thermal models that explore various integration locations, both at the package and device level.

1 citations

Proceedings ArticleDOI
02 Dec 2013
TL;DR: In this paper, the authors presented a method for the visualization of refractive index non homogeneities in a phase object, where the temperature gradients in a cooling fluid for buoyancy-induced convective flow can be visualized in an electronic system during its operation.
Abstract: Natural convection heat transfer occurs when the fluid buoyancy motion is induced by density differences themselves caused by the heating. A temperature gradient causes a density variation in a cooling fluid with a related local change in the refractive index. The gradient of refractive index has the effect of bending the light. The thermal load of the device causes an optical deflection in the cooling fluid that an opportune light probe can reveal. Analyzing the deflection of the light probe it is possible to go back to the related temperature gradient. The experimental work in this paper represents a very simple method for the visualization of refractive index non homogeneities in a phase object: the temperature gradients in a cooling fluid for buoyancy-induced convective flow can be visualized in an electronic system during its operation. The developed experimental set-up allows to reveal local refractive index changes in a phase objects. A fringe pattern is acquired, through the cooling fluid under analysis, with a digital camera two times: the first one with the fluid at rest, the second one with the thermal load due to the electronic device normal operation. By the means of the MATLAB processing of the acquired images it's possible to reveal the shape and the directions of the thermal flow lines for the cooling fluid. In this way we can obtain a deeper understanding of the optimal convection working volume or information for the optimization of the relative spatial positioning of the several electronic components in a complex electronic system, like a printed circuit board (PCB). The experimental set-up was optically implemented: the analysis is absolutely no-contact and carried out without distortion for the thermal flow and without alteration for the temperature gradients in the fluid under test. The proposed technique has been applied on two typical heat extraction situations recurrent in the electronic devices: are presented the experimental results of the visualization of the natural convection buoyancy driven air flow for an heat sink and a power resistor. In both the cases it was possible to visualize the bouyancy induced flow generated, in air, by the heated sample and understand the shape of the isogradients lines in the test field and the involved working volume in the cooling fluid. The results presented show that is possible to monitore the onset and the development of the natural convection thermal flow and the perturbation in the thermal gradient map caused by externally added air flow with a simple and cheap noninvasive optical setup.

1 citations

Patent
04 Feb 2006
TL;DR: In this article, a closed single-loop low-energy/energy-independent cryocooler that removes high quantities of heat from a large area while utilizing a design that allows multiple temperatures on multiple cooled areas in parallel to allow for use on complex electronics which have different preferred operating temperatures.
Abstract: An closed single-loop low-energy/energy-independent cryocooler that removes high quantities of heat from a large area while utilizing a design that allows multiple temperatures on multiple cooled areas in parallel to allow for use on complex electronics which have different preferred operating temperatures. An energy independent design is a simple TEG based variation of the standard invention design. Said system allows for different uses such as for the cooling of over-clocked computer systems working at high heat loads, superconducting circuits, and/or the efficient cooling of temperature dependent devices such as laser diodes and etc. The said cooling system comprises of a hydraulic or pneumatic driven cylindrical single piston gas compressor, several multi-stage thin-film thermoelectric coolers (TEC), several thin-film single-stage high temperature thermoelectric generators (TEG), an enclosure with hollow passages inside the walls or attached loops of coiled copper tubes, a multi-way heat exchanger, and a evaporator.

1 citations

Patent
18 Apr 2016
TL;DR: In this paper, an air-cooled heat sink, an auxiliary air-moving device, and an airflow blocking mechanism are used to dissipate heat from the electronic component(s) to a cooling airflow passing across the heat sink.
Abstract: Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

1 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849