scispace - formally typeset
Search or ask a question
Topic

Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
More filters
Proceedings ArticleDOI
12 May 2021
TL;DR: In this paper, a subcooled pool boiling characteristics is investigated using a compact vessel with less than 100 mL of volume at low pressure, and micro bubble emission boiling can be observed at low-pressure.
Abstract: There is a strong demand for compact cooling devices, which can remove a high heat flux. Boiling heat transfer attracts a lot of attention because of its higher heat transfer coefficient than conventional techniques using a single-phase flow. To design the compact cooling device using boiling heat transfer, it is important to investigate the boiling characteristics in a compact vessel. Moreover, the operating temperature of cooling device depends on the pressure in the vessel. Therefore, in this study, subcooled pool boiling characteristics is investigated using a compact vessel with less than 100 mL of volume at low pressure. As a result, micro bubble emission boiling can be observed at low pressure.

1 citations

Proceedings ArticleDOI
01 Sep 2018
TL;DR: In this article, the overall performance of a two-stage wire-to-wire EHD air pump is experimentally investigated, providing measurements on the produced air velocity and electric power requirements.
Abstract: Electrohydrodynamic (EHD) fluid pumps use a properly shaped high electric field to create mechanical flow of a dielectric fluid without involving mechanical moving parts. They have several distinct practical advantages and they have been proposed as a workable solution for a large number of applications, especially when miniaturization and/or silent operation is required. Numerous experimental studies have proven their advantages over mechanical solutions, especially for food drying and electronics cooling. A large portion of the research efforts is focused on various techniques to improve the overall efficiency and performance of existing concepts. Among other concepts, the implementation of multiple cascaded stages is recently drawing the attention of researchers. In this paper the overall performance of a two-stage wire-to-wire EHD air pump is experimentally investigated, providing measurements on the produced air velocity and electric power requirements. The experimental results were very promising, indicating that the air flow velocity and the efficiency of a two-stage cascading EHD pump are considerably higher in comparison to the traditional single-stage design. The proposed two-stage configuration was found to be directly comparable with existing mechanical fans of similar diameter in terms of flow characteristics, yet maintaining the general advantages of EHD pumping technology.

1 citations

Proceedings ArticleDOI
05 Jul 2012
TL;DR: In this paper, a micro-compressor is used for small enclosures and command panels with the use of a new miniaturized linear compressor called microcompressor, which is a direct current (DC) oil-free compressor that uses R-134a as refrigerant fluid.
Abstract: For electronics cooling, the matching between size and efficiency is a desirable aspect of the design of cooling units. Hence, the compact cooling units are suitable for this area of refrigeration due to high capacity by size ratio and lightweight. For this purpose, Embraco developed a new refrigerating system for small enclosures and command panels with the use of a new miniaturized linear compressor called microcompressor. This unit consists in an outdoor mounted air-conditioning with finned-tube heat exchangers whereas the microcompressor is a direct current (DC) oil-free compressor that uses R-134a as refrigerant fluid. The paper presents a detailed description about the cooling unit and its performance tests. In order to run all experimental tests, a cooling unit calorimeter was assembled. In the experimental facility, the ambient temperature was varied for evaluation purposes whereas the bulk temperature inside the enclosure was kept at 35 °C via an electric heater. A commercially available thermoelectric system used for electronics cooling was also tested and compared with the vapor compression system. The results have shown that the microcompressor unit presented a coefficient of performance (COP) approximately two times larger than thermoelectric solution and higher cooling capacities were achieved under low ambient temperatures.

1 citations

Proceedings ArticleDOI
01 Oct 2007
TL;DR: In this paper, a solid-state system model of "designer" thermal conducting nano/micro materials used for more effective heat spreading in electronic packaging manufacture is described, which is a macro example of a replacement for the thermal conducting packaging material structures currently used in electronics.
Abstract: A solid-state system model of “Designer” thermal conducting nano/micro materials used for more effective heat spreading in electronic packaging manufacture is described. The “Designer” materials are much lighter (sp.gr. 2.5g/cc vs. 9.2g/cc) and stronger (modulus 500–820Gpa vs 120GPa) than copper. The material has a coefficient of thermal expansion (1×10−6 vs. 17×10−6) much higher thermal conductivity (500–1200W/mK vs. 390W/mK) and greater heat spreading capabilities. In addition there is the ability to control the thermal conductivity, coefficient of thermal expansion and thermal spreading coefficient in any of the three material dimensions. A brief description characterizing the material and its manufacturing process is here-within. To illustrate the performance gain of using these materials, the base plate of Intel’s CPU Cooler CL-P0030 heat-sink is chosen as an example of a high-heat source cooling device i.e. ≫100W/cm2. Heat greater than 100Wm2 is equivalent to the concentrated focused energy of ≫1000 Suns. (electronic devices melt in seconds without proper cooling) This is a macro example of a replacement for the thermal conducting packaging material structures currently used in electronics.

1 citations

Proceedings ArticleDOI
01 Jan 2019
TL;DR: An abridged overview of what was presented in the keynote lecture on microchannel two-phase flow and boiling is presented, giving a visual view of microchannel flow boiling, some prediction methods and some prototype units.
Abstract: In this paper, I will present an abridged overview of what is presented in my keynote lecture I will recount some of the initial history of microchannel two-phase flow and boiling work by others that enticed me to join into the development of this field and will then focus on some my own team's work at the EPFL in Lausanne during the last 20 years, covering work on microchannel flow boiling, new flow visualization/image processing techniques, flow stabilization, heat transfer models, flow pattern maps, micro-two-phase cooling systems, and numerical modeling of bubbly/slug flows (not all in this paper), with much effort to get micro-two-phase cooling into practice The lecture gives a visual view of microchannel flow boiling, some prediction methods and some prototype units

1 citations


Network Information
Related Topics (5)
Heat transfer
181.7K papers, 2.9M citations
83% related
Thermal conductivity
72.4K papers, 1.4M citations
78% related
Thermal conduction
60.6K papers, 1.1M citations
73% related
Laminar flow
56K papers, 1.2M citations
72% related
Wafer
118K papers, 1.1M citations
72% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849