Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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1 citations
19 Mar 2018
TL;DR: In this article, the authors present recent advancements in OHP-based heat spreaders and heat sinks for high power density, densely-packaged electronics systems, which can transfer higher heat fluxes from devices of complex geometries.
Abstract: Oscillating heat pipes (OHPs) have been the subject of significant research. Prior literature includes examples with higher overall thermal resistances and temperature fluctuations than typically desired in electronics cooling. More recent research has led to more stable OHP performance, with thermal resistances competitive with conventional heat pipes while transferring higher heat fluxes from devices of complex geometries. This paper presents recent advancements in OHP-based heat spreaders and heat sinks for high power density, densely-packaged electronics systems.
1 citations
TL;DR: In this article, the user has 71 major systems for multiple machine control in 15 locations in the United States, all relays in 42 can body and heat-seal tape-applying lines.
Abstract: The user has 71 major systems for multiple machine control in 15 locations in Continental United States. The systems eliminate all relays in 42 can body and heat-seal tape-applying lines which do metal piercing and forming, heating, cooling, and transferring operations. Some of these systems have performed with no maintenance since February 1964. Twenty-five cutting, piercing, sealing, and assemblying presses are similarly equipped. Four can body-former and side-seam soldering machines now operate successfully without relays, and some electronic tube devices thereon have been eliminated.
1 citations
25 Jun 2007
TL;DR: In this paper, the authors discuss the instrumentation required for such an experiment, in particular as applied to testing the Helical Cooling Channel (HCC) proposed by Muons Inc.
Abstract: Within the framework of the Fermilab Muon Collider Task Force, the possibility of developing a dedicated muon test beam for cooling experiments has been investigated. Cooling experiments can be performed in a very low intensity muon beam by tracking single particles through the cooling device. With sufficient muon intensity and large enough cooling decrement, a cooling demonstration experiment may also be performed without resolving single particle trajectories, but rather by measuring the average size and position of the beam. This allows simpler, and thus cheaper, detectors and readout electronics to be used. This paper discusses muon production using 400MeV protons from the Linac, decay channel and beamline design, as well as the instrumentation required for such an experiment, in particular as applied to testing the Helical Cooling Channel (HCC) proposed by Muons Inc.
1 citations
Proceedings Article•
01 Oct 1983
TL;DR: In this article, the design approach taken for heating and cooling an unmanned container hut, which contains electronic local switching equipment, to maintain the container hut air temperature and relative humidity within a given range.
Abstract: This paper explains the design approach taken for heating and cooling an unmanned container hut, which contains electronic local switching equipment, to maintain the container hut air temperature and relative humidity within a given range. Electronic switch reliability is assured. A new small air-cooled package airconditioner, which has both a refrigerant cycle with a compressor and a thermosiphon in one body, was developed for this container hut. A field test clarified that the new airconditioner saves 20%~30% of the power needed for cooling, compared with a conventional airconditioner. Air temperature and relative humidity in the container hut are adequately controlled.
1 citations