Topic
Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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01 Dec 2011TL;DR: In this paper, an experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards, and the thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.
Abstract: An experimental study is realized in order to verify the mini heat pipe concept for cooling high power dissipation electronic cards. Two kinds of card substrates are considered: alumina and FR4 epoxy, and the chip on board technology is used. Different prototypes of configurations on reporting the chip on the card are tested. The thermal measurements show that the use of heat pipes allows for significantly reduced temperature gradients and maximum chip temperature decrease.
1 citations
01 Oct 2000
1 citations
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11 May 2003TL;DR: In this article, an inexpensive doubled heat sink in extruded aluminum forms the base of the enclosure and the electronics are inserted into one part and is enclosed by a complementary shielding surface.
Abstract: A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heat sink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heat sink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions. EMC-issues are also addressed in this paper; seams are modeled and simulated as short wave guides intercepted by screw joints. The simulations were carried out in CST Microwave Studio.
1 citations
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01 May 2016TL;DR: In this article, the authors developed a numerical model to predict the dry-out heat flux of thin film evaporation from micropillar array wick structures based on a finite volume approach.
Abstract: Capillary-driven thin film evaporation in wick structures is promising for thermal management of high-power electronics because it harnesses the latent heat of evaporation without the use of an external pumping power. The complexities associated with liquid-vapor interface and liquid flow through the wick structures, however, make it challenging to optimize the wick structure geometries to boost the dry-out heat flux. In this work, we developed a numerical model to predict the dry-out heat flux of thin film evaporation from micropillar array wick structures. The model simulates liquid velocity, pressure, meniscus curvature and contact angle along the length of the wick surface through conservation of mass, momentum and energy, based on a finite volume approach. In particular, we captured the three-dimensional meniscus shape, which varies along the wicking direction, by solving the Young-Laplace equation. We determined the dry-out heat flux upon the condition that the minimum contact angle on the micropillar surface reaches the receding contact angle. With this model, we calculated the dry-out heat flux as a function of micropillar structure geometries (diameter, pitch and height), and optimized the geometry to maximize the dry-out heat flux. Our model provides an understanding of the role of the wick structures in capillary-driven thin film evaporation and offers important design guidelines for thermal management of high-performance electronic devices.
1 citations
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TL;DR: In this article, a rack cooling system for the VENUS detector has been developed, which uses forced-air cooling and has enough cooling power for crates with as much as 1500 Watts of power consumption.
Abstract: A rack cooling system for the VENUS detector has been developed. It uses forced-air cooling and has enough cooling power for crates with as much as 1500 Watts of power consumption. The design and the cooling performance for FASTBUS crates are reported.
1 citations