Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.

Control by B.M.S. for a cooling system

Abstract: This paper presents an application of a control system, part of a Building Management System (BMS), implemented in a large supermarket from Bucharest. One can find a short introduction to BMS, to the cooling system and to the concepts of the used control system. Experimental data were extracted over several hot summer days of working. Finally, some conclusions are introduced.

Noise Measurements and Reduction for High-Frequency Vibrating Devices in the Application of Cooling Electronics

Abstract: Traditional heat sinks for electronics cooling have become ever more difficult to design to meet the high dissipation rate of modern high-heat-flux electronics. Active devices, especially devices operating at a high frequency, show promise toward enhancing heat transfer performance. However, active devices generate noise that may not be acceptable to personnel. The present work studies acoustic characteristics of piezoelectrically-driven synthetic jets and oscillating plate agitators operating at high frequency (around 1000 Hz) employed in an electronics cooling module for heat transfer enhancement purposes. The A-weighted noise level from such actuators is measured and found to increase with increases of driving voltage and operational frequency. The measured sound pressure level of the active devices used in our present enhanced heat transfer module can be as high as 100 dB. Through a power spectrum analysis, we find that most acoustic energy is in a narrow frequency band close to the operating frequency of the active device. To decrease the noise level, a muffler, which also allows cooling air to recirculate through the equipment cabinet, has been designed and tested. An analytical model is employed to select the geometry of the muffler for optimal performance based on acoustic characteristics of the active devices and the through-flow pressure drop. The muffler having this optimal design is fabricated and tested and found to be able to decrease the noise level generated by two actuators from 83 dB to 64 dB.Copyright © 2012 by ASME

Comparisons of various cooling schemes within a confined space

Abstract: Consideration is given to a array consisting of a number of identical electronic modules. The modules are arranged into many rows, and each row includes a number of modules (18 modules in the present case). Each module dissipates 14 W. To reduce the maximum temperature and temperature variation over the array, several cooling schemes are investigated: (1) a single, unidirectional flow; (2) a side-by-side, bidirectional flow, and (3) a top-to-bottom, bidirectional flow. Numerical examples are used to demonstrate the features of each approach. It is found that the top-to-bottom, bidirectional flow system is the most effective cooling method in maintaining low temperature and the small temperature differences of the system. For a given flow rate, the effect of the unequal channel flow on the temperature distribution is also discussed. >