scispace - formally typeset
Search or ask a question
Topic

Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


Papers
More filters
Book ChapterDOI
01 Jan 2010
TL;DR: In this article, the fundamental flow and heat transfer phenomena in microchannels, the most common numerical and experimental characterization techniques, microfabrication methods, and the application of micro-channels in thermal management of high heat flux electronics are discussed.
Abstract: Systems for energy conversion, heat rejection, and sensing and control often incorporate heat exchange devices. Recent developments in microfabrication and assembly methods have led to significant miniaturization of these systems. Miniaturized heat exchange devices have commonly utilized microchannel flow passages. This chapter reviews the fundamental flow and heat-transfer phenomena in microchannels, the most common numerical and experimental characterization techniques, microfabrication methods, and the application of microchannels in thermal management of high heat flux electronics. The range of channel hydraulic diameters covered in this chapter is from a few micrometers to a few millimeters where the larger diameter transport characteristics become valid.

1 citations

Proceedings ArticleDOI
01 Jun 2004
TL;DR: In this paper, an experimental study was conducted to investigate the heat transfer from a parallel flat plate heat sink under a turbulent impinging air jet, where a horizontal nozzle plate confined the target surface.
Abstract: An experimental study was conducted to investigate the heat transfer from a parallel flat plate heat sink under a turbulent impinging air jet. A horizontal nozzle plate confined the target surface. The jet was discharged from a sharp-edged nozzle in the nozzle plate. Average Nusselt numbers are reported for Pr=0.7, 5000/spl les/Re/spl les/30000, L/d=2.5 and 0.833 at H/d=3 where L, H and d define the length of the square heat source, nozzle-to-target spacing and nozzle diameter, respectively. Tests were also conducted for an impinging flow over a flat plate, flush with the top surface of the target plate. The average Nusselt numbers from the heat sink were compared to those for a flat plate to determine the overall performance of the heat sink in a confined impingement arrangement. The experimental results were compared with the numerical predictions obtained in an earlier study.

1 citations

Proceedings ArticleDOI
01 Jan 2003
TL;DR: In this paper, the performance of graphite foam thermosyphon design in electronics cooling has been investigated, and the best thermal performance was achieved with the large graphite foams, working fluid with the lowest boiling point, and at the lowest sub-cooling temperature.
Abstract: Graphite foams consist of a network of interconnected graphite ligaments and are beginning to be applied to thermal management of electronics. The thermal conductivity of the bulk graphite foam is similar to aluminum, but graphite foam has one-fifth the density of aluminum. This combination of high thermal conductivity and low density results in a specific thermal conductivity about five times higher than that of aluminum, allowing heat to rapidly propagate into the foam. This heat is spread out over the very large surface area within the foam, enabling large amounts of energy to be transferred with relatively low temperature difference. For the purpose of graphite foam thermosyphon design in electronics cooling, various effects such as graphite foam geometry, sub-cooling, working fluid effect, and liquid level were investigated in this study. The best thermal performance was achieved with the large graphite foam, working fluid with the lowest boiling point, a liquid level with the exact height of the graphite foam, and at the lowest sub-cooling temperature.

1 citations

Proceedings ArticleDOI
01 Jun 2021
TL;DR: In this paper, a novel pulsating heat pipe is presented, and its performance is tested with a low-GWP working fluid, and the best performance was achieved with the refrigerant R1233zd(E), able to dissipate 850 W (heat flux of 30 W/cm2), corresponding to an overall thermal resistance of 0.065 K/W.
Abstract: With the advancement of technologies such as Artificial Intelligence and 5G telecommunications, where computational rate is constantly pushing its limits, highly efficient and reliable cooling devices are starting to become an overly critical factor. Not only good performance and reliability are needed, but final users are also aiming to minimize maintenance and costs. These are the reasons why a device that uses inherent forces of two-phase flow is so attractive. In this paper, a novel pulsating heat pipe is presented, and its performance is tested with a low-GWP working fluid. The novel pulsating heat pipe has a footprint area of 75 x 65 mm2 and a height of 18.5 mm. The secondary side of the device is water-cooled. The experimental results highlight how the flow regimes detected via the temperature’s readings affect the thermal performance. The performance of the pulsating heat pipe is defined as the maximum heat load dissipated from the source, while maintaining its base temperature to a value of 90°C. Among all the conditions tested, the best performance was achieved with the refrigerant R1233zd(E), able to dissipate 850 W (heat flux of 30 W/cm2), corresponding to an overall thermal resistance of 0.065 K/W.

1 citations

Dissertation
01 Nov 2006
TL;DR: Meinders et al. as mentioned in this paper investigated and developed low Reynolds number models for use in electronics cooling CFD calculations, including zero-equation, single equation, and four zonal models.
Abstract: Semiconductors are at the heart of electronic devices such as computers, mobile phones, avionics systems, telecommunication racks, etc. Power dissipation from semiconductor devices is continuing to increase due to the growth in the number of transistors on the silicon chip as predicted by Moore's Law. Thermal management techniques, used to dissipate this power, are becoming more and more challenging to design. Air cooling of electronic components is the preferred method for many designs where the air flow is characterised as being in the laminar-to-turbulent transitional region. Over the last fifteen years there has been a dramatic take-up of Computational Fluid Dynamics (CFD) technology in the electronics industry to simulate the airflow and temperatures in electronic systems. These codes solve the Reynolds Averaged Navier-Stokes (RANS) equations for momentum and turbulence. RANS models are popular as they are much quicker to solve than time-dependent models such as Large Eddy Simulation (LES) or Direct Numerical Simulation (DNS). At present the majority of thermal design engineers use the standard k-e model which is a high Reynolds number model. This is because there is limited knowledge on the benefit of using low Reynolds number models in the electronics cooling industry. This Ph.D. investigated and developed low Reynolds number models for use in electronics cooling CFD calculations. Nine turbulence models were implemented and validated in the in-house CFD code PHYSICA. This includes three zero-equation, two single equation, and four zonal models. All of these models are described in the public literature except the following two models which were developed in this study: AUTO_CAP: This zero-equation model automates the existing LVEL_CAP model available within the commercial CFD code FLOTHERM. ke I kl: This zonal model uses a new approach to blend the k — l model used at the wall with the k-e model used to predict the bulk airflow. Validation of these turbulence models was undertaken on eight different test cases. This included the detailed experimental work undertaken by Meinders. Results show that the ke I kl model provides the most accurate flow predictions. For prediction of temperature there was no clear favourite. This was probably due to the use of the universal log-law function in this study. A generalised wall function may be more appropriate. Results from this research have been disseminated through a total of nine peer-reviewed conference and journal publications, evidence of the interest the topic of this investigation generates amongst electronic packaging engineers.

1 citations


Network Information
Related Topics (5)
Heat transfer
181.7K papers, 2.9M citations
83% related
Thermal conductivity
72.4K papers, 1.4M citations
78% related
Thermal conduction
60.6K papers, 1.1M citations
73% related
Laminar flow
56K papers, 1.2M citations
72% related
Wafer
118K papers, 1.1M citations
72% related
Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849