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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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01 Jan 2015
TL;DR: In this article, a heat sink is a passive component that cools a device by dissipating heat into the surrounding air, which can be used to cool electronic components such as high power semiconductor devices, and optoelectronic devices such as higher power lasers and light emitting diodes (LED).
Abstract: Radial or annular fins are one of the most popular choices for exchanging the heat transfer rate from the primary surface of cylindrical or any shape. In electronic systems, a heat sink is passive component that cools a device by dissipating heat into the surrounding air. Heat sinks are used to cool electronic components such as high-power semiconductor devices, and optoelectronic devices such as higher-power lasers and light emitting diodes (LED). Light emitting diode lights have recently attracted the attention of the illumination industry, due to their lower power consumption, longer life, and smaller, more durable structure compared to other light sources However, their use presents a thermal problem, since about 70% of their total energy consumption emitted as heat.

1 citations

Proceedings ArticleDOI
01 Jun 2017
TL;DR: In this article, the authors dealt with multiple jet cooling experiments on a heated target and found that the higher number of jets with 16mm pitch indicates better cooling performance and is annualized by Nusselt number which is measure of cooing performance.
Abstract: Electronics cooling has wide area of research and have been experimented with different techniques. Present paper deals with multiple jet cooling experiments on heated target. These can be applicable for high heat dissipating objects or targets from power electronics or electrical section. Two type of jet plates are used viz. four jets in a plate and nine jets in a plate. The specified target is hot surface cooled by convective heat transfer by using jets, which is impinged using air as working fluid. Pitch indicating distance between two adjacent jets is varying from 15mm to 30 mm gradually for both the types of jet plates. All experiments are performed at Reynolds Number of 2000. The target to jet height is also varied from 4mm to 16mm. The higher number of jets with 16mm pitch indicates better cooling performance and is annualized by Nusselt number which is measure of cooing performance.

1 citations

Book ChapterDOI
01 Jan 2021
TL;DR: In this article, a new technology like sinusoidal synthetic jet employed for the micro-channel cooling was used for electronics cooling, such as liquid cooling, fans, active and microchannel cooling, which has made the heat dissipation more momentous problem than ever.
Abstract: Miniaturization of electronic component has made the heat dissipation more momentous problem than ever because of which failure due to heating has increased by 50% [1]. Various methods have been developed for electronics cooling such as liquid cooling, fans, active and micro-channel cooling. The present study focuses on new technology like sinusoidal synthetic jet employed for the micro-channel cooling.

1 citations

Book ChapterDOI
18 Feb 2021
TL;DR: In this paper, the effect of ethanol nanodroplets on the convective flow and heat transfer characteristics of a novel nanostructured heat transfer fluid, namely, ethanol/polyalphaolefin nanoemulsion, inside a conventionally manufactured minichannel of circular cross section and a microchannel heat exchanger of rectangular cross section manufactured additively using the Direct Metal Laser Sintering (DMLS) process.
Abstract: The present study experimentally and numerically investigates the flow and heat transfer characteristics of a novel nanostructured heat transfer fluid, namely, ethanol/polyalphaolefin nanoemulsion, inside a conventionally manufactured minichannel of circular cross section and a microchannel heat exchanger of rectangular cross section manufactured additively using the Direct Metal Laser Sintering (DMLS) process. The experiments were conducted for single-phase flow of pure polyalphaolefin (PAO) and ethanol/PAO nanoemulsion fluids with two ethanol concentrations of 4 wt% and 8 wt% as well as for two-phase flow boiling of nanoemulsion fluids to study the effect of ethanol nanodroplets on the convective flow and heat transfer characteristics. Furthermore, the effects of flow regime of the working fluids on the heat transfer performance for both the minichannel and microchannel heat exchangers were examined within the laminar and transitional flow regimes. It was found that the ethanol/PAO nanoemulsion fluids can improve convective heat transfer compared to that of the pure PAO base fluid under both single- and two-phase flow regimes. While the concentration of nanoemulsion fluids did not reflect a remarkable distinction in single-phase heat transfer performance within the laminar regime, a significant heat transfer enhancement was observed using the nanoemulsion fluids upon entering the transitional flow regime. The heat transfer enhancement at higher concentrations of nanoemulsion within the transitional regime is mainly attributed to the enhanced interaction and interfacial thermal transport between ethanol nanodroplets and PAO base fluid. For two-phase flow boiling, heat transfer coefficients of ethanol/PAO nanoemulsion fluids were further enhanced when the ethanol nanodroplets underwent phase change. A comparative study on the flow and heat transfer characteristics was also implemented between the traditionally fabricated minichannel and additively manufactured microchannel of similar dimensions using the same working fluid of pure PAO and the same operating conditions. The results revealed that although the DMLS fabricated microchannel posed a higher pressure loss, a substantial heat transfer enhancement was achieved as compared to the minichannel heat exchanger tested under the same conditions. The non-post processed surface of the DMLS manufactured microchannel is likely to be the main contributor to the augmented heat transfer performance. Further studies are required to fully appreciate the possible mechanisms behind this phenomenon as well as the convective heat transfer properties of nanoemulsion fluids.

1 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849