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Electronics cooling

About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.


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Patent
10 Sep 2020
TL;DR: In this paper, a cooling system with bimetal elements can increase system reliability with a cost reduction by increasing system reliability and reducing the cost of the cooling system, which can increase the fluid flow between two enclaves.
Abstract: An apparatus includes a first enclosure (102) having an interior that is at a first temperature (T1) and a second enclosure (104) having an interior that is at a second temperature (T2). An opening (106) allows fluid to flow between the interior of the first enclosure (102) and the interior of the second enclosure (104). A bimetal valve (108) is positioned in the opening (106) to regulate the fluid flow between the first enclosure (102) and the second enclosure (104) depending on the first temperature (T1) or on the difference between the first temperature (T1) and the second temperature (T2). The apparatus using a cooling system with bimetal elements can increase system reliability with a cost reduction.
01 Jan 2010
TL;DR: In this paper, a heat pipe loop (HPL) is proposed to exploit the advantages of both heat pipes and loop heat pipes while eliminating their shortcomings. But, unlike traditional heat pipes, the HPL is not designed to operate on evaporation and condensation of a fluid and uses capillary forces in the wick for the fluid circulation.
Abstract: Current standard military vehicle thermal managemen t systems are based on single phase air/liquid cooling. To meet increasingly stringent demands for high power electronics thermal control, two-phase cooling solutions show great potential and can satisfy the need for compact and high heat flux heat acquisitio n, transport and dissipation under vibration and shock conditions. One novel two-phase cooling technology that has been developed in this work is a new Heat Pipe Loop (HPL), which exploits the advantages of both h eat pipes and loop heat pipes while eliminating their s hortcomings. Similar to heat pipes and loop heat pi pes, the HPL operates on evaporation and condensation of a w orking fluid and uses capillary forces in the wick for the fluid circulation. Unlike in a heat pipe, the liquid and vapor in the HPL flow in separate passages ma de from smooth wall tubing. This results in a low pressure drop and consequently great heat transfer capacity and distance over which the heat can be transferred. The evaporator wick in a HPL is also made in-situ t hrough a low cost manufacturing process and has a high therm al conductance, much like the low cost traditional heat pipe wick. To demonstrate the HPL technology, a com pact 3kW HPL thermal management system was successfully designed, built and tested in an envir onment representative of military combat vehicles. This system consisted of six compact plug-and-play HPL modules. Each HPL module was designed to transport 500W of waste heat from two discrete high power devices on an electronics board to a chassis level thermal bus that was a pumped liquid loop. The HPL evaporator (or heat source) temperature was maintained below 80°C with a heat sink temperature of 30-50°C. The advantages of the HPL technology include: (1) Passive operation and high reliability; (2) Low cost in-situ wick fabrica tion; (3) High conductivity evaporator wicks; (4) L ong distance heat transfer capability; and (5) Insensitivity to vibration/shock and gravitational orientation.
Proceedings ArticleDOI
26 Jun 2007
TL;DR: In this paper, both experimental and numerical methods are adopted to investigate the heat transfer between the air swirling impinging jets and an iso-heat-flux simulant chip, where the simulated data is impacted by the swirling jet which is generated by inserting twisted strips into round nozzles.
Abstract: The rapid miniaturization of the electronic packaging accelerated the development of air cooling technology. In this research, both experimental and numerical methods are adopted to investigate the heat transfer between the air swirling impinging jets and an iso-heat-flux simulant chip. In the experiment scheme, the simulant chip is impacted by the swirling jet which is generated by inserting twisted strips into round nozzles. In some range of flow Reynolds number, the effects of nozzle-to-plate spacement, the geometries of the nozzle and the thread intervals of the twisted strips are examined, and then the radial distributions of Nusselt numbers on the target plate are obtained. Meanwhile, the heat transfer characteristics of the swirling jet in both the stagnation region and the wall jet region are interpreted. In order to verify its heat transfer effect, the swirling jet is compared to the ordinary straight one. Afterwards, numerical simulation is also performed to study the heat transfer effect of this cooling system, in which, a simplified axisymmetric model is built. The angular velocity of the swirling jet, the flow Reynolds number, the dimension of the nozzle and the nozzle-to-plate spacings are all examined, and then the distribution of heat transfer coefficient (Nusselt number) on the simulant chip is also obtained.
01 Jan 2013
TL;DR: In this article, a modified experimental method was proposed to estimate the heat transfer rate and used it to calculate the thermal performance through different theoretical pressure drop equations, and the newly developed comparison method allowed a detailed numerical study of the influence of waveform pin cross-section on the performance of pin fin arrays used in the electronics industry.
Abstract: The work reported in this paper is an attempt to enhance heat transfer in electronic devices with the use of waveform pin-finned heat sinks. The cooling performance of electronic devices has attracted increased attention owing to the demand of compact size, higher power densities and demands on system performance and re-liability. Pressure drop across heat sink is one of the key variables that govern the thermal performance of the heat sink in forced convection environment. There are several analytical methods to estimate the heat transfer rate, however correctly selecting one that can represent the reality over a range of airflow found in typical electronics cooling application is difficult. In this paper, we propose a modified experimental method to estimate the heat transfer and used it to calculate the thermal performance through different theoretical pressure drop equations. The rapid advancement in technology of microprocessors has led electronics thermal system designer is to pay increased attention to the waveform fin heat sink. The advantages of using a waveform fin heat sink are light weight, low profile and small footprint. There are three manufacturing methods for bonding the waveform fin to the base of heat sink: adhesive bonding, soldering, and brazing.The newly developed comparison method allowed a detailed numerical study of the influence of waveform pin cross-section on the performance of pin fin arrays used in the electronics industry.

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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202255
202172
202045
201952
201849