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Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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01 Jan 2017
TL;DR: In this paper, the authors present a list of figures, tables, and nomenclature of tables and discuss the relationship between figures and tables in the context of table-based models.
Abstract: .......................................................................................................................................... 4 List of figures ................................................................................................................................ 10 List of tables .................................................................................................................................. 14 Nomenclature ................................................................................................................................ 15 Chapter 1 .......................................................................................................................... 16 1.
01 Jan 2014
TL;DR: In this paper, a direct air-cooled heat exchanger strategy for high-temperature power electronic devices with an application specific to automotive traction drive inverters is presented, where heat dissipation and system pressure curves versus flow rate for baseline and optimized sub-module assemblies containing two ceramic resistance heaters that provide device heat fluxes.
Abstract: This work demonstrates a direct air-cooled heat exchanger strategy for high-temperature power electronic devices with an application specific to automotive traction drive inverters. We present experimental heat dissipation and system pressure curves versus flow rate for baseline and optimized sub-module assemblies containing two ceramic resistance heaters that provide device heat fluxes. The maximum allowable junction temperature was set to 150°C, 175°C, and 200°C. Results were extrapolated to the inverter scale and combined with balance-of-inverter components to estimate inverter power density and specific power.
TL;DR: In this article , an assessment of self-oscillating jets for use in cooling applications is investigated, where the authors use the unsteady Reynolds-Averaged Navier-Stokes and energy equations to assess the thermal features of the flow field.
Abstract: In the present computational study, an assessment of self-oscillating jets for use in cooling applications is investigated. The jet exits from a square nozzle into a narrow rectangular cavity at a Reynolds number of 54,000 based on nozzle hydraulic diameter and average jet exit velocity. The heated devices, such as electronic chips, are located externally on the surface of the cavity. A three-dimensional numerical simulation of the flow is conducted by solving the unsteady Reynolds-Averaged Navier-Stokes and energy equations to assess the thermal features of the flow field. The unsteady Elliptic Blending Reynolds Stress Model, which consists of transport equations for each of the stress tensor components, was used to model turbulence. The cooling performance of a self-oscillating jet is compared with that of a wall jet and a channel flow for the same flow conditions and the same arrangement of the hot devices. The cooling efficacy of two different arrangements of the heated devices is also evaluated. The self-oscillating jet provides a higher heat transfer for the heated blocks which are located farther from the central region, while the wall jet improves heat transfer around the central region. Self-oscillating jets can improve heat transfer over a larger area when the heated devices are aligned orthogonal to the axis of the nozzle. On a Nusselt number comparative basis, the channel flow provides the least desirable heat transfer performance.
14 Sep 2020
TL;DR: The presented method is based on a finite difference implementation approximating the thermal performance of the heat sink by its base plate and compared to CFD models and the arrangement of the pin fins is optimized using a genetic algorithm.
Abstract: The demand for electronics cooling is increasing with growing power density in modern electronic devices. High heat transfer capabilities and a small pressure drop thereby characterize optimal heat sink designs. In the development of efficient heat sinks, additive manufacturing allow more geometrical degrees of freedom. However, conjugate convective heat transfer analyses of entire heat sinks are computationally expensive within an optimization process. The presented method is based on a finite difference implementation approximating the thermal performance of the heat sink by its base plate. Heat sources and the characteristics of a priori optimized single pin fins, are coupled into the system via artificial boundary conditions. Based on a 2D heat sink setup, the methodology is compared to CFD models and the arrangement of the pin fins is optimized using a genetic algorithm. Although the FD model is imprecise in determining absolute values, it provides an appropriate estimation of the relative quantities and can serve as an initial geometry setup for topology optimizations.
01 Jul 2020
Abstract: Metal foams have shown promise in enhancing heat dissipation from heated surfaces and find applications in forced convection cooling environments like electronics cooling. The thermal and hydraulic performance of metal foams have a strong correlation to its pore density (pores per inch: PPI) and porosity. While high pore density is desired to enhance heat dissipation (due to higher effective heat transfer area), high porosity is suitable to maintain low pressure drop in forced convective cooling applications. Towards this end, an experimental study was carried out to evaluate the thermal-hydraulic performance of high pore density (90 PPI), high porosity (95%), thin Copper foams (3 mm thick) strategically placed over a heated surface of base area 20 mm x 20 mm. Heat transfer was facilitated with air as the working fluid impinging through a 3x3 array (x⁄d j = y⁄d j = 4) of circular nozzles of diameter, d j = 1.5 mm. Two metal foam-heated surface configurations were tested, a full foam configuration; where the metal foam covered the entire heated surface area, and a foam stripes configuration, where metal foam stripes were strategically placed over the heated surface, were studied for their heat transfer, pressure drop and thermal hydraulic performance at Reynolds numbers (Re j ) between 3000 and 12000. A smooth surface, without metal foam, served as the baseline case. Additionally, the effect of varying jet-to-target plate distance (z) as z⁄d j = 2, 3, 5, 7 was studied. From experiments, it was observed that the stripes configuration had highest heat transfer enhancement of about 1.45 times that of the smooth surface target, at the expense of a marginal increase in pumping power, thereby making it the best configuration in terms of thermal hydraulic performance.