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Electronics cooling
About: Electronics cooling is a research topic. Over the lifetime, 1135 publications have been published within this topic receiving 17608 citations.
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Patent•
10 Dec 1999
TL;DR: In this paper, the image projection system has a unit with a liquid crystal controlled (31,32) lighting system (11,10), and projection lens (5), and there are command electronics and cooling mechanisms (116,117,118,141).
Abstract: The image projection system has a unit with a liquid crystal controlled (31,32) lighting system (11,10), and projection lens (5). There are command electronics and cooling mechanisms (116,117,118,141). There is an air intake (106) and air filtering (115) under the optical unit.
TL;DR: In this paper , a hybrid manifold microchannel with bifurcations was proposed to improve thermal performance, and the shape of the bifurlcation was optimized to enhance the overall performance.
TL;DR: In this paper , the theoretical modeling of a nanofluid-filled copper cylindrical heat pipe for electronics cooling applications is presented, where the model can predict the capillary limit as well as the heat transfer in the different sections of the heat pipe.
Abstract: Thermal management of electric and electronic components is a critical issue and needs to consider enhanced cooling systems such as heat pipes. This study deals with the theoretical modeling of a nanofluid-filled copper cylindrical heat pipe for electronics cooling applications. The heat pipe includes helicoidal and trapezoidal capillary grooves. The model can predict the capillary limit as well as the heat transfer in the different sections of the heat pipe. The thermal resistances of the evaporation and condensation sections are calculated based on correlations for heat transfer, which are determined from experiments. Two working nanofluids are considered: water/CuO and water/Al2O3. The thermal performances are predicted for different concentrations and heat sink temperatures, and the heat pipe is positioned horizontally. For both nanofluids, the results indicate that augmenting the concentration of the nanoparticles leads to a capillary limit increase reaching up to 14 % and 25 % for water/Al2O3 and water/CuO, respectively, and an overall thermal resistance decrease reaching up to 51 % and 68 % for water/Al2O3 and water/CuO. Moreover, decreases up to 24 %, and up to 18 % in the evaporator wall temperatures are obtained for water/CuO and water/Al2O3 nanofluids, respectively. The nanofluid water/CuO gives the best thermal performance whatever the nanoparticle concentration and heat sink temperature.
TL;DR: A thermocouple/core cooling monitor is described in this article, which provides a nuclear reactor operator with rapidly available, readily understandable data concerning the adequacy of cooling of the reactor core.
Abstract: A Thermocouple/Core Cooling Monitor is described. The system provides a nuclear reactor operator with rapidly available, readily understandable data concerning the adequacy of cooling of the reactor core. The functions of the instrument are briefly described and inadequacies of earlier in-core thermocouple data presentation techniques are reviewed. Descriptions of the thermocouples, the reference junction boxes, and the data processing hardware and software are given. Operational experience to date is summarized.